Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE5206-2S
MA000621042
PG-TO220-7-12
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
11.039
0.908
0.272
906.793
2.538
8.805
96.855
481.342
23.005
0.216
0.001
0.179
0.144
6.855
0.175
0.584
582.824
Average
Mass
[%]
0.52
0.04
0.01
42.73
0.12
0.41
4.56
22.68
1.08
0.01
0.00
0.01
0.01
0.32
0.01
0.03
27.46
28. August 2013
2122.54 mg
Sum
[%]
0.52
Average
Mass
[ppm]
5201
428
128
42.78
0.12
427222
1196
4148
45632
27.65
1.08
226777
10839
102
0.01
0
85
68
0.34
3229
82
275
27.50
274588
274945
1000000
3382
102
276557
10839
427778
1196
Sum
[ppm]
5201
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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