Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLV4906L
MA000602226
PG-SSO-3-2
Material Group
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
Substances
silicon
chromium
titanium
silver
tin
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-47-3
7440-32-6
7440-22-4
7440-31-5
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.563
0.153
0.153
0.204
0.306
50.200
0.044
0.211
0.263
0.527
4.792
20.538
4.889
0.284
0.062
0.247
Average
Mass
[%]
0.67
0.18
0.18
0.24
0.37
60.18
0.05
0.25
0.32
0.63
5.74
24.62
5.86
0.34
0.07
0.30
28. August 2013
83.44 mg
Sum
[%]
0.67
Average
Mass
[ppm]
6744
1834
1834
2446
3669
61.15
0.05
601663
531
2525
3156
6312
57435
31.56
5.86
0.34
246151
58597
3408
739
0.37
2956
3695
1000000
315579
58597
3408
611446
531
Sum
[ppm]
6744
wire
encapsulation
non noble metal
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
leadfinish
plating
glue
*deviation
non noble metal
noble metal
plastics
noble metal
< 10%
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com