CM6304
EMI Filters with ESD
Protection for SIM Card
Applications
Product Description
The CM6304 is a 3 x 3, 8−bump EMI filter with ESD protection
device for SIM card applications in a 0.4 mm pitch CSP form factor. It
is fully compliant with IEC 61000−4−2. The CM6304 is also RoHS II
compliant.
Table 1. PIN DESCRIPTIONS
8−bump CSP Package
Pin
A2
A3
B1
B2
B3
C1
C2
C3
Channel 1 External
Channel 1 Internal
Channel 2 External
GND
Channel 2 Internal
Channel 3 External
V External
Channel 3 Internal
Description
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WLCSP8
CASE 567CF
MARKING DIAGRAM
+
64
WWY
64
WWY
= CM6304
= Date Code
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
1
A
B
C
2
3
A
Bottom View
(Bumps Up View)
3
A3
B3
C3
2
A2
B2
C2
1
A1
B1
C1
Orientation
Marking
ORDERING INFORMATION
Device
CM6304
Package
CSP−8
(Pb−Free)
Shipping
†
5000/Tape & Reel
Orientation
Marking
+
64
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
B
C
ELECTRICAL SCHEMATIC
V (C2) {External}
O1 (A3)
O2 (B3)
O3 (C3)
External
R1
R2
R3
I1 (A2)
I2 (B1)
I3 (C1)
Internal
GND (B2)
©
Semiconductor Components Industries, LLC, 2011
April, 2011
−
Rev. 6
1
Publication Order Number:
CM6304/D
CM6304
ELECTRICAL SPECIFICATIONS AND CONDITIONS
Table 2. PARAMETERS AND OPERATING CONDITIONS
Parameter
Storage Temperature Range
Operating Temperature Range
Rating
–55 to +150
–40 to +85
Units
°C
°C
Table 3. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
R
1
R
2
R
3
C
Resistance
Resistance
Resistance
Capacitance on filter channels 1, 2 and 3
Capacitance on clamp channel (pin C2)
V
B
V
ESD
Breakdown Voltage (Positive)
ESD Protection Peak Discharge Voltage at A2, B1 and C1 pins
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
ESD Protection Peak Discharge Voltage at C2 pin
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
ESD Protection Peak Discharge Voltage at A3, B3 and C3 pins
a) Contact Discharge per IEC 61000−4−2 standard
b) Air Discharge per IEC 61000−4−2 standard
1. All parameters specified at T
A
= 25°C unless otherwise noted.
2. Standard IEC 61000−4−2 with C
Discharge
= 150 pF, R
Discharge
= 330
W.
At 1 MHz, V
IN
= 0 V
At 1 MHz, V
IN
= 0 V
I
F
= 8 mA
(Note 2)
Parameter
Conditions
Min
80
37.6
80
13.4
8.2
6
±15
±15
±15
±15
±4
±4
Typ
100
47
100
16.7
10.3
6.8
Max
120
56.4
120
20
12.4
20
Units
W
W
W
pF
pF
V
kV
(Note 2)
kV
(Note 2)
kV
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2
CM6304
PACKAGE DIMENSIONS
WLCSP8, 1.2x1.2
CASE 567CF−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
DIM
A
A1
A2
b
D
E
e
MILLIMETERS
MIN
MAX
0.63
0.57
0.17
0.24
0.41 REF
0.24
0.29
1.20 BSC
1.20 BSC
0.40 BSC
D
A B
2X
2X
0.05 C
0.05 C
0.05 C
A
0.05 C
NOTE 3
A1
8X
b
C
B
A
1
2
3
0.05 C A B
0.03 C
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ÈÈ
ÈÈ
TOP VIEW
A2
SIDE VIEW
e
BOTTOM VIEW
PIN A1
REFERENCE
E
RECOMMENDED
SOLDERING FOOTPRINT*
C
SEATING
PLANE
A1
PACKAGE
OUTLINE
8X
e
0.25
0.40
PITCH
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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4
CM6304/D
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