Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4276SV
MA000714748
PG-TO220-5-12
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
3.304
0.923
0.277
921.567
0.226
1.214
55.864
550.135
24.181
0.008
3.285
0.122
0.098
4.658
0.177
0.590
589.466
Average
Mass
[%]
0.15
0.04
0.01
42.74
0.01
0.06
2.59
25.52
1.12
0.00
0.15
0.01
0.00
0.22
0.01
0.03
27.34
28. August 2013
2156.09 mg
Sum
[%]
0.15
Average
Mass
[ppm]
1532
428
128
42.79
0.01
427423
105
563
25910
28.17
1.12
255154
11215
4
0.15
1523
57
45
0.23
2161
82
274
27.38
273396
273752
1000000
2263
1527
281627
11215
427979
105
Sum
[ppm]
1532
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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