Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4961-3M
MA000975354
PG-SOT23-3-15
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.350
0.001
0.004
0.011
3.590
0.020
0.054
1.153
4.157
0.150
0.149
0.032
0.152
Average
Mass
[%]
3.56
0.01
0.04
0.11
36.55
0.20
0.55
11.74
42.34
1.52
1.51
0.33
1.54
28. August 2013
9.82 mg
Sum
[%]
3.56
Average
Mass
[ppm]
35590
73
367
1101
36.71
0.20
365541
2042
5462
117435
54.63
1.52
1.51
423313
15238
15130
3274
1.87
15434
18708
1000000
546210
15238
15130
367082
2042
Sum
[ppm]
35590
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com