Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4699GM
MA000970054
PG-DSO-14-30
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
acrylic resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
2.837
0.015
0.060
1.207
49.007
0.192
0.172
7.925
78.046
1.226
1.030
0.304
1.077
Average
Mass
[%]
1.98
0.01
0.04
0.84
34.25
0.13
0.12
5.54
54.55
0.86
0.72
0.21
0.75
28. August 2013
143.10 mg
Sum
[%]
1.98
Average
Mass
[ppm]
19823
105
422
8434
35.14
0.13
342469
1341
1204
55383
60.21
0.86
0.72
545401
8569
7196
2124
0.96
7529
9653
1000000
601988
8569
7196
351430
1341
Sum
[ppm]
19823
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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