Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TDA7116F
MA000873246
PG-TSSOP-10-3
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.989
0.002
0.009
0.027
8.828
0.100
0.091
0.113
0.227
2.063
8.841
0.505
0.836
0.079
0.314
Average
Mass
[%]
4.30
0.01
0.04
0.12
38.35
0.44
0.39
0.49
0.98
8.96
38.39
2.19
3.63
0.34
1.37
28. August 2013
23.02 mg
Sum
[%]
4.30
Average
Mass
[ppm]
42950
77
385
1155
38.52
0.44
383461
4360
3938
4923
9846
89599
49.21
2.19
3.63
383994
21948
36291
3415
1.71
13658
17073
1000000
492300
21948
36291
385078
4360
Sum
[ppm]
42950
wire
encapsulation
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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