Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TDK5101F
MA000872104
PG-TSSOP-10-3
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
brominated resin
antimonytrioxide
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
1309-64-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.875
0.002
0.009
0.027
8.828
0.100
0.055
0.069
0.138
1.253
5.368
0.505
0.836
0.860
3.441
Average
Mass
[%]
15.28
0.01
0.04
0.10
34.81
0.39
0.22
0.27
0.54
4.94
21.16
1.99
3.29
3.39
13.57
28. August 2013
25.37 mg
Sum
[%]
15.28
Average
Mass
[ppm]
152774
70
350
1049
34.96
0.39
348046
3939
2171
2713
5427
49381
27.13
1.99
3.29
211635
19921
32940
33917
16.96
135667
169584
1000000
271327
19921
32940
349515
3939
Sum
[ppm]
152774
wire
encapsulation
noble metal
organic material
plastics
inorganic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
电源技术
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