Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
wire
encapsulation
SPU01N60C3
MA000851398
PG-TO251-3-21
Material Group
inorganic material
non noble metal
non noble metal
non noble metal
organic material
inorganic material
plastics
plastics
Substances
silicon
tin
copper
aluminium
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
nickel
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7440-31-5
7440-50-8
7429-90-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
0.893
0.273
181.882
0.958
1.359
2.841
3.212
23.469
92.642
3.976
0.344
0.033
0.026
1.262
0.011
0.036
36.124
Average
Mass
[%]
0.26
0.08
52.06
0.27
0.39
0.81
0.92
6.72
26.52
1.14
0.10
0.01
0.01
0.36
0.00
0.01
10.34
28. August 2013
349.34 mg
Sum
[%]
0.26
Average
Mass
[ppm]
2557
782
52.14
0.27
520644
2743
3889
8132
9193
67181
35.36
1.14
0.10
265190
11380
985
95
76
0.38
3612
31
104
10.35
103406
103541
1000000
3783
353585
11380
985
521426
2743
Sum
[ppm]
2557
leadfinish
plating
solder
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com