Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4290D
MA000714216
PG-TO252-5-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
3.794
0.205
0.061
204.243
0.110
0.295
13.579
133.727
5.072
0.076
0.000
0.131
0.105
4.995
Average
Mass
[%]
1.04
0.06
0.02
55.73
0.03
0.08
3.71
36.50
1.38
0.02
0.00
0.04
0.03
1.36
28. August 2013
366.39 mg
Sum
[%]
1.04
Average
Mass
[ppm]
10355
558
167
55.81
0.03
557444
299
806
37062
40.29
1.38
364982
13844
208
0.02
1
357
285
1.43
13632
14274
1000000
209
402850
13844
558169
299
Sum
[ppm]
10355
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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