OT PLD, 25ns, TTL, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最大时钟频率 | 13.3 MHz |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 专用输入次数 | 8 |
| I/O 线路数量 | |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 0 I/O |
| 输出函数 | REGISTERED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 25 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |

| PAL16R8A-2ML/883B | PAL16L8-7PC | PAL16L8A-2MW/883B | PAL16R4A-2ML/883B | PAL16R8BCN | PAL16R6A-2ML/883B | |
|---|---|---|---|---|---|---|
| 描述 | OT PLD, 25ns, TTL, CQCC20, CERAMIC, LCC-20 | OT PLD, 10ns, TTL, PDIP20, PLASTIC, DIP-20 | OT PLD, 50ns, TTL, CDFP20, CERAMIC, FP-20 | OT PLD, 50ns, TTL, CQCC20, CERAMIC, LCC-20 | OT PLD, 15ns, TTL, PDIP20, PLASTIC, DIP-20 | OT PLD, 50ns, TTL, CQCC20, CERAMIC, LCC-20 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QLCC | DIP | DFP | QLCC | DIP | QLCC |
| 包装说明 | QCCN, | DIP, | DFP, | QCCN, | DIP, | QCCN, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknown |
| JESD-30 代码 | S-CQCC-N20 | R-PDIP-T20 | R-GDFP-F20 | S-CQCC-N20 | R-PDIP-T20 | S-CQCC-N20 |
| 专用输入次数 | 8 | 10 | 10 | 8 | 8 | 8 |
| I/O 线路数量 | - | 6 | 6 | 4 | - | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 75 °C | 125 °C | 125 °C | 75 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | - | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 0 I/O | 10 DEDICATED INPUTS, 6 I/O | 10 DEDICATED INPUTS, 6 I/O | 8 DEDICATED INPUTS, 4 I/O | 8 DEDICATED INPUTS, 0 I/O | 8 DEDICATED INPUTS, 2 I/O |
| 输出函数 | REGISTERED | COMBINATORIAL | COMBINATORIAL | MIXED | REGISTERED | MIXED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | DIP | DFP | QCCN | DIP | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 25 ns | 10 ns | 50 ns | 50 ns | 15 ns | 50 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | NO | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | COMMERCIAL EXTENDED | MILITARY | MILITARY | COMMERCIAL EXTENDED | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| ECCN代码 | 3A001.A.2.C | - | 3A001.A.2.C | 3A001.A.2.C | - | 3A001.A.2.C |
| 最大时钟频率 | 13.3 MHz | - | - | 13.3 MHz | 37 MHz | 13.3 MHz |
| JESD-609代码 | e0 | e0 | e0 | - | - | e0 |
| 端子面层 | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | - | - | TIN LEAD |
| 厂商名称 | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | - |
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