OTP ROM, 8KX8, 35ns, BICMOS, CQCC28, METAL SEALED, CERAMIC, LCC-28
| 参数名称 | 属性值 |
| 包装说明 | QCCN, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 35 ns |
| JESD-30 代码 | S-CQCC-N28 |
| 长度 | 11.43 mm |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 组织 | 8KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.16 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.43 mm |
| MB71C44-35CV | MB71C44-35Z | MB71C44-35ZSK | MB71C44-45ZSK | MB71C44-45Z | MB71C44-45CV | |
|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 8KX8, 35ns, BICMOS, CQCC28, METAL SEALED, CERAMIC, LCC-28 | OTP ROM, 8KX8, 35ns, CDIP24 | 8KX8 OTPROM, 35ns, CDIP24, 0.300 INCH, CERDIP-24 | 8KX8 OTPROM, 45ns, CDIP24, 0.300 INCH, CERDIP-24 | OTP ROM, 8KX8, 45ns, BICMOS, CDIP24, 0.600 INCH, CERDIP-24 | OTP ROM, 8KX8, 45ns, CQCC28 |
| 包装说明 | QCCN, | DIP, DIP24,.6 | DIP, | DIP, | DIP, | QCCN, LCC28,.45SQ |
| Reach Compliance Code | unknown | compliant | unknown | unknown | unknown | compliant |
| 最长访问时间 | 35 ns | 35 ns | 35 ns | 45 ns | 45 ns | 45 ns |
| JESD-30 代码 | S-CQCC-N28 | R-XDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | S-XQCC-N28 |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 28 | 24 | 24 | 24 | 24 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 最高工作温度 | 75 °C | 70 °C | 75 °C | 75 °C | 75 °C | 70 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC |
| 封装代码 | QCCN | DIP | DIP | DIP | DIP | QCCN |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | NO | YES |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 长度 | 11.43 mm | - | 30.3 mm | 30.3 mm | 31.78 mm | - |
| 功能数量 | 1 | - | 1 | 1 | 1 | - |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | - |
| 座面最大高度 | 2.16 mm | - | 5.84 mm | 5.84 mm | 5.84 mm | - |
| 最大供电电压 (Vsup) | 5.25 V | - | 5.25 V | 5.25 V | 5.25 V | - |
| 最小供电电压 (Vsup) | 4.75 V | - | 4.75 V | 4.75 V | 4.75 V | - |
| 技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | - |
| 宽度 | 11.43 mm | - | 7.62 mm | 7.62 mm | 15.24 mm | - |
| 零件包装代码 | - | DIP | DIP | DIP | - | QLCC |
| 针数 | - | 24 | 24 | 24 | - | 28 |
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