
Fully Integrated Power Management IC (PMIC) with Power Path and Battery Charger 155-DSBGA -40 to 85
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DSBGA-155 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-XBGA-B155 |
| JESD-609代码 | e1 |
| 长度 | 5.364 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 17 |
| 功能数量 | 1 |
| 端子数量 | 155 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 5 A |
| 最大输出电压 | 3.3 V |
| 最小输出电压 | 0.6 V |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | VFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 座面最大高度 | 0.625 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.4 mm |
| 端子位置 | BOTTOM |
| 宽度 | 5.214 mm |
| Base Number Matches | 1 |
| TWL6032A1B4YFFR | TWL6032A1B4YFFT | TWL6032A1B6YFFR | |
|---|---|---|---|
| 描述 | Fully Integrated Power Management IC (PMIC) with Power Path and Battery Charger 155-DSBGA -40 to 85 | Fully Integrated Power Management IC (PMIC) with Power Path and Battery Charger 155-DSBGA -40 to 85 | Fully Integrated Power Management IC (PMIC) with Power Path and Battery Charger 155-DSBGA -40 to 85 |
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