MAFR2A~MAFR2M
Surface Mount Fast Recovery Rectifiers
Features
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Low profile package
Ideal for automated placement
Glass passivated chip junction
Fast switching for high efficiency
High forward surge capability
High temperature soldering：
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
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Major Ratings and Characteristics
Mechanical Date
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I
F(AV)
V
RRM
I
FSM
t
rr
V
F
T
j
max.
2.0 A
50 V to 1000 V
50 A
150nS, 250nS, 500nS
1.3 V
150 °C
Case:
JEDEC MSMA molded plastic
body over glass passivated chip
Terminals:
Solder plated, solderable per
J-STD-002B and JESD22-B102D
y
Polarity:
Laser band denotes cathode end
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Maximum Ratings & Thermal Characteristics
(T
A
= 25 °C unless otherwise noted)
Items
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current 8.3 ms single
half sine-wave superimposed on rated load
Thermal resistance from junction to lead
(1)
Operating junction and storage temperature
range
Symbol
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
R
θJL
T
J，
T
STG
MAFR MAFR MAFR MAFR MAFR MAFR MAFR
2A
2B
2D
2G
2J
2K
2M
50
35
50
100
70
100
200
140
200
400
280
400
2.0
50
35
–55 to +150
600
420
600
800
560
800
1000
700
1000
UNIT
V
V
V
A
A
℃/W
℃
Note 1: Mounted on P.C.B. with 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas.
Electrical Characteristics
Items
Instantaneous forward voltage
Reverse current
Reverse recovery time
Typical junction capacitance
(T
A
= 25 °C unless otherwise noted)
Test conditions
I
F
=2.0A
(2)
V
R
=V
DC
T
j
=25℃
T
j
=125℃
Symbol
V
F
I
R
t
rr
C
J
MAFR2A~
MAFR2G
MAFR2J
1.3
5
100
MAFR2K~
MAFR2M
UNIT
V
μA
I
F
= 0.5 A , I
R
= 1.0 A ,
I
rr
= 0.25 A
4.0V,1.0MHz
150
20
250
500
15
nS
pF
Note 2: Pulse test:300μs pulse width,1% duty cycle.
http://www.trr-jx.com
MAFR2A~MAFR2M
Surface Mount Fast Recovery Rectifiers
Package Outline
Notice
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Product is intended for use in general electronics applications.
Product should be worked less than the ratings; if exceeded, may cause permanent damage.or introduce latent failure
mechanisms.
The absolute maximum ratings are rated values and must not be exceeded during operation. The following are the general
derating methods you design a circuit with a device.
I
F(AV)
: We recommend that the worst case current be no greater than 80% .
I
FSM
: This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation, which the general
during the lifespan of the device.
T
J
:
Derate this rating when using a device in order to ensure high reliability. We recommend that the device be used at
a T
J
of below 125°C.
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TRR is registered trademark of Rising-sun Technology. Rising-sun Technology reserves the right to make changes to any product in this
specification to improve reliability,functional characteristics,or design without notice.
Rising-sun Technology does not assure any liability arising out of the applications or any product described in this specification.
Rising-sun Technology advises customers to obtain the latest version of the device information before placing orders to verify that the
required information is current.
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http://www.trr-jx.com
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