Product Discontinued - Not for New Designs
EnerChip
™
CBC050
Rechargeable Solid State Energy Storage: 50µAh, 3.8V
Features
•
•
•
•
•
•
All Solid State Construction
SMT Package and Process
Lead-Free Reflow Tolerant
Thousands of Recharge Cycles
Low Self-Discharge
Eco-Friendly, RoHS Compliant
8 mm x 8 mm
QFN SMT Package
The EnerChip™ CBC050 is a surface-mount, solid
state, rechargeable energy storage device rated
for 50µAh at 3.8V. It is ideal as a localized, on-
board power source for SRAMs, real-time clocks
and microcontrollers which require standby power
to retain time or data. It is also suitable for RFID
tags, smart sensors, and remote applications
which require a miniature, low-cost, and rugged
power source. For many applications, the CBC050
is a superior alternative to coin cell batteries and
supercapacitors.
Because of their solid state design, EnerChip™
storage devices are able to withstand solder reflow
temperatures and can be processed in high-
volume manufacturing lines similar to conventional
semiconductor devices. There are no harmful gases,
liquids or special handling procedures, in contrast to
traditional rechargeable batteries.
The EnerChip recharge is fast and simple, with a
direct connection to a 4.1V voltage source and
no current limiting components. Recharge time is
20 minutes to 80% capacity. Robust design offers
thousands of charge/discharge cycles. The CBC050
is packaged in an 8 mm x 8 mm quad flat package. It
is available in reels for use with automatic insertion
equipment.
Electrical Properties
Output voltage:
Capacity (typical):
Charging source:
Recharge time to 80%:
Charge/Discharge cycles:
3.8V
50µAh
4.00V to 4.15V
20 minutes
>5000 to 10% DOD
Physical Properties
Package size:
Operating temperature:
Storage temperature:
8 mm x 8 mm
-40°C to 70°C
-40°C to 125°C
Applications
•
•
•
•
•
•
Standby supply
for non-volatile SRAM, real-time
clocks, controllers, supply supervisors, and other
system-critical components.
Wireless sensors and RFID tags
and other
powered, low duty cycle applications.
Localized power source
to keep microcontrollers
and other devices alert in standby mode.
Power bridging
to provide backup power to
system during exchange of main batteries.
Energy Harvesting
by coupling the EnerChip
with energy transducers such as solar panels.
Embedded Energy
where bare die can be
embedded into modules or co-packaged with
other ICs.
Pin Number(s)
Description
1
V+
4
V-
2,3
NIC
5-16
NIC
Note: NIC = No Internal Connection
CBC050 Schematic - Top View
DS-72-01 Rev E
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
Page 1 of 6
EnerChip™ CBC050 Solid State Battery
Operating Characteristics
Parameter
Discharge Cutoff Voltage
Charge Voltage
Pulse Discharge Current
Cell Resistance (25°C)
Self-Discharge (5-yr. average; 25°C)
Operating Temperature
Storage Temperature
Recharge Cycles
(to 80% of rated
capacity; 4.1V charge
voltage)
25°C
40°C
Condition
25°C
25°C
25°C
Charge cycle 2
Charge cycle 1000
Non-recoverable
Recoverable
-
-
10% depth-of-discharge
50% depth-of discharge
10% depth-of-discharge
50% depth-of-discharge
Charge cycle 2
Charge cycle 1000
100µA discharge; 25°C
Min
3.0
(1)
4.0
(2)
300
(3)
-
-
-
-
-40
-40
5000
1000
2500
500
-
-
50
Typical
-
4.1
-
500
2250
2.5
1.5
(4)
25
-
-
-
-
-
20
60
-
Max
-
4.3
-
1250
5000
-
-
+70
125
(5)
-
-
-
-
35
95
-
Units
V
V
µA
Ω
% per year
% per year
°C
°C
cycles
cycles
cycles
cycles
minutes
µAh
Recharge Time (to 80% of rated capacity;
4.1V charge voltage)
(6)
Capacity
(1)
(2)
(3)
(4)
(5)
(6)
Failure to cutoff the discharge voltage at 3.0V will result in EnerChip performance degradation.
Charging at 4.0V will charge the cell to approximately 70% of its rated capacity.
At a pulse duration = 20 milliseconds.
First month recoverable self-discharge is 5% average.
Storage temperature is for uncharged EnerChip.
EnerChip charging time and cell resistance increase approximately 2x per 10°C decrease in temperature.
EnerChip Discharge Characteristics
Note: All specifications contained within this document are subject to change without notice
DS-72-01 Rev E
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
Page 2 of 6
EnerChip™ CBC050 Solid State Battery
Package Dimensions - 16-pin QFN (package code M8)
Cymbet Logo
Lot Number
Part Number
Date Code
CBC050
Labeling
Information
Placement
[Dimensions in inches [mm]
DS-72-01 Rev E
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
Page 3 of 6
EnerChip™ CBC050 Solid State Battery
Printed Circuit Board (PCB) Layout Guidelines and Recommendations
Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup
energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering
power to an integrated circuit in low power mode. Therefore, solder flux must be thoroughly washed from the
board following soldering. The PCB layout can make this problem worse if the cell’s positive and negative
terminals are routed near each other and under the package, where it is difficult to wash the flux residue away.
To avoid this situation, make sure positive and negative traces are routed outside of the package footprint to
ensure that flux residue will not cause a discharge path between the positive and negative pads. Similarly, a
leakage current path can exist from the package lead solder pads to the exposed die pad on the underside of
the package as well as any solder pad on the PCB that would be connected to that exposed die pad during the
reflow solder process. Therefore, it is strongly recommended that the PCB layout not include a solder pad in the
region where the exposed die pad of the package will land. It is sufficient to place PCB solder pads only where
the package leads will be. That region of the PCB where the exposed die pad will land must not have any solder
pads, traces, or vias.
When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside of
the package and all metal pads. Failure to observe this precaution can result in package cracking during solder
reflow due to the silk screen material interfering with the solder solidification process during cooling.
A recommended CBC050 PCB layout is shown in Figure 1 below. Notice that there should not be a center pad
on the PCB to mate with the exposed die pad on the CBC050 package. Again, this is to reduce the possible
number and severity of leakage paths between the EnerChip terminals.
Add soldering, ESD warnings.
16
1
15
14
13
12
2
11
10
3
4
9
5
6
7
8
Dimensions in inches [mm]
Figure 1: Recommended PCB layout for the CBC050 package. Do not route signal traces under the EnerChip
as they could become shorted to the die pad (as shown by the dotted lines) on the package underside.
Handling EnerChips as MSL 3 Devices
EnerChip CBC050 devices are rated Moisture Sensitivity Level 3 and must be mounted and reflowed within 168
hours of being removed from the moisture barrier antistatic bag.
Soldering, Rework, and Electrical Test
Refer to the Cymbet User Manual AN-1026 for soldering, rework, and replacement of the EnerChip on printed
circuit boards, and for instructions on in-circuit electrical testing of the EnerChip.
Cymbet, the Cymbet Logo and EnerChip are trademarks of Cymbet Corporation. All Rights Reserved
DS-72-01 Rev E
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
Page 4 of 6
EnerChip™ CBC050 Solid State Battery
HAND SOLDERING TECHNIQUES
When soldering the EnerChip using by hand at a soldering station, adhere to the following guidelines:
•
•
•
Observe the ESD precautions outlined in this document.
Never solder an EnerChip that has been partially or fully charged, even if the EnerChip is in a
discharged state. This includes wave soldering and reflow soldering.
Minimize the amount of time that heat is applied to the EnerChip. Using a tweezer-type soldering iron
tip that applies heat to two opposite sides or the entire perimeter of the device simultaneously will
result in more uniform heating of the package and for a shorter period of time than when soldering one
pin or package edge at a time.
If possible, apply solder paste to the solder pads on the PCB prior to placing the EnerChip on the board;
this will promote wetting of the solder and reduce the amount of time the soldering iron is applied to the
component and solder pads.
Place the EnerChip onto the PCB by hand and solder in place rather than grabbing the EnerChip with
a heated tweezer-type tip and placing the EnerChip on the board with the iron. This will minimize the
amount of time the EnerChip is exposed to heat.
Most surface mount packages have metal leadframe tie points that do not extend to the bottom surface
of the package but are exposed on two more of the package sidewalls. When soldering, ensure that
solder does not cover these tie points, as this situation could result in package pins being shorted to
one another through the metal leadframe.
•
•
•
ENERCHIP ASSEMBLY REPAIR TECHNIQUES
Should the need arise to replace an EnerChip that has already been soldered to a circuit board, due to bat-
tery failure, improper package placement, or other circumstances, it is recommended that the EnerChip being
replaced be discarded and replaced with a new EnerChip. When removing the EnerChip from the board, use
a tweezer-type soldering iron tip that heats opposite sides of the package simultaneously and lift the package
from the board. When applying the new EnerChip to the board, follow the hand soldering guidelines in the previ-
ous section.
For QFN-style packages, use a hot air rework station to remove a defective or misplaced EnerChip package. If
there are other EnerChips in the vicinity of the EnerChip being replaced, use proper heat shielding to protect
the adjacent EnerChip package from the heat source and turn off any heat source that would otherwise be
used to heat the bottom of the board during removal of the EnerChip. This will prevent the adjacent EnerChip(s)
from being damaged during the rework procedure.
If it is not possible to replace the EnerChip with a new EnerChip, use extreme care when removing the EnerChip
from the board to minimize the amount of time heat is applied to the package during removal and re-soldering.
Follow the guidelines in the previous section pertaining to hand soldering. Under no circumstances should an
EnerChip that has been partially or fully charged - even if subsequently discharged - be subjected to reflow,
wave, or hand soldering.
Conductive epoxy may also be used as an attachment method. If the cure temperature is above 70°C, then a
new (i.e., never charged) EnerChip must be used.
DS-72-01 Rev E
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
Page 5 of 6
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
