BYG22A THRU BYG22D
Super Fast Silicon Mesa SMD Rectifier
50V-200V
2.0A
FEATURES
D
D
D
D
D
D
D
D
Controlled avalanche characteristic
Glass passivated junction
Low reverse current
Low forward voltage
Soft recovery characteristic
Very fast reverse recovery time
Good switching characteristics
Wave and reflow solderable
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Parameter
Reverse voltage
g
=Repetitive peak reverse voltage
Peak forward surge current
Average forward current
Junction and storage
temperature range
Pulse energy in avalanche mode,
non repetitive
(inductive load switch off)
Test Conditions
Type
BYG22A
BYG22B
BYG22D
Symbol
V
R
=V
RRM
V
R
=V
RRM
V
R
=V
RRM
I
FSM
I
FAV
T
j
=T
stg
I
(BR)R
=1A, T
j
=25
°
C
E
R
Value
50
100
200
35
2
–55...+150
20
Unit
V
V
V
A
A
°
C
mJ
t
p
=10ms,
half sinewave
Maximum Thermal Resistance
Parameter
Test Conditions
Junction lead
T
L
=const.
Junction ambient mounted on epoxy–glass hard tissue
mounted on epoxy–glass hard tissue, 50mm
2
35
m
m Cu
mounted on Al–oxid–ceramic (Al
2
O
3
), 50mm
2
35
m
m Cu
Symbol
R
thJL
R
thJA
R
thJA
R
thJA
Value
25
150
125
100
Unit
K/W
K/W
K/W
K/W
Electrical Characteristics
Parameter
Forward voltage
g
Reverse current
Reverse recovery time
Test Conditions
I
F
=1A
I
F
=2A
V
R
=V
RRM
V
R
=V
RRM
, T
j
=100
°
C
I
F
=0.5A, I
R
=1A, i
R
=0.25A
Type
Symbol
V
F
V
F
I
R
I
R
t
rr
Min
Typ
Max
1
1.1
1
10
25
Unit
V
V
m
A
m
A
ns
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Web Site: www.taychipst.com
BYG22A THRU BYG22D
Super Fast Silicon Mesa SMD Rectifier
50V-200V
2.0A
RATINGS AND CHARACTERISTIC CURVES
100
I
R
– Reverse Current (
m
A )
I
F
– Forward Current ( A )
BYG22A THRU BYG22D
100
10
10
T
j
= 125°C
1
75°C
1
V
R
= V
R RM
0.1
25°C
0.1
0.01
0
94 9347
0.01
40
80
120
160
200
94 9352
0
0.6
1.2
1.8
2.4
3.0
T
j
– Junction Temperature (
°C
)
V
F
– Forward Voltage ( V )
Figure 1. Typ. Reverse Current vs. Junction Temperature
Figure 3. Max. Forward Current vs. Forward Voltage
140
I
FAV
– Average Forward Current ( A )
t
rr
– Reverse Recovery Time ( ns )
2.0
1.6
R
thJA
=25K/W
1.2
100K/W
0.8
0.4
150K/W
0
0
40
80
120
160
200
125K/W
T
amb
= 125°C
120
100
80
60
40
25°C
20
0
0
0.2
I
R
=0.5A, i
R
=0.125A
0.4
0.6
0.8
1.0
I
F
– Forward Current ( A )
100°C
75°C
50°C
94 9351
T
amb
– Ambient Temperature (
°C
)
94 9353
Figure 2. Max. Average Forward Current vs.
Ambient Temperature
Z
thp
– Thermal Resistance for Pulse Cond. (K/W)
Figure 4. Max. Reverse Recovery Time vs.
Forward Current
1000
125K/W DC
100
t
p
/T=0.5
t
p
/T=0.2
10
t
p
/T=0.1
t
p
/T=0.05
t
p
/T=0.02
t
p
/T=0.01
1
10
–5
10
–4
10
–3
10
–2
10
–1
10
0
10
1
10
2
Single Pulse
94 9339
t
p
– Pulse Length ( s )
Figure 6. Thermal Response
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Web Site: www.taychipst.com
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