Datasheet> 器件分类 > 模拟混合信号IC> 过滤器> 1206H1000473MXRE03

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1206H1000473MXRE03: 产品描述Feed Through Capacitor, 2 Function(s), 100V, EIA STD PACKAGE SIZE 1206; 产品类别模拟混合信号IC 过滤器; 文件大小413KB，共2页; 制造商Knowles; 官网地址http://www.knowles.com

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1206H1000473MXRE03概述

Feed Through Capacitor, 2 Function(s), 100V, EIA STD PACKAGE SIZE 1206

1206H1000473MXRE03规格参数

参数名称	属性值
是否Rohs认证	不符合
包装说明	EIA STD PACKAGE SIZE 1206
Reach Compliance Code	compliant
其他特性	FLEXICAP TERMINATION
电容	47000 µF
滤波器类型	FEED THROUGH CAPACITOR
高度	1.1 mm
最小绝缘电阻	10000 MΩ
JESD-609代码	e0
长度	3.2 mm
制造商序列号	X2Y
安装类型	SURFACE MOUNT
功能数量	2
最高工作温度	125 °C
最低工作温度	-55 °C
包装方法	REEL
物理尺寸	L3.2XB1.6XH1.1 (mm)/L0.126XB0.063XH0.043 (inch)
额定电压	100 V
端子面层	Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
宽度	1.6 mm

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sales@syfer.co.uk

www.syfer.com

Surface mount EMI filters

X2Y Integrated Passive Components

X2Y

The Syfer X2Y Integrated Passive Component is a 3

terminal EMI chip device.

When used in balanced line applications, the

revolutionary design provides simultaneous line-to-

line and line-to-ground filtering, using a single ceramic

chip. In this way, differential and common mode

filtering are provided in one device.

For unbalanced applications, it provides ultra low ESL

(equivalent series inductance). Capable of replacing 2

or more conventional devices, it is ideal for balanced

and unbalanced lines, twisted pairs and dc motors, in

automotive, audio, sensor and other applications.

Available in sizes from 0603 to 2220, these filters can

prove invaluable in meeting stringent EMC demands.

Manufactured in the UK by Syfer Technology Limited under licence from X2Y attenuators LLC.

+44 1603 723310

+44 1603 723301

Dielectric

X7R or C0G/NP0

Typical capacitance matching

Better than 5%

Temperature rating

-55°C to 125°C

Insulation resistance

100Gohms or 1000s (whichever is the less)

Syfer Technology Limited

Electrical configuration

Multiple capacitance

Capacitance measurement

At 1000hr point

Dielectric withstand voltage

<200V 2.5 times rated Volts for 5 secs

500V 1.5 times rated Volts for 5 secs

Charging current limited to 50mA Max.

Type

Chip size

Rated

voltage

16Vdc

25Vdc

50Vdc

100Vdc

200Vdc

500Vdc

Dielectric

C0G/NP0

X7R

C0G/NP0

X7R

C0G/NP0

X7R

C0G/NP0

X7R

C0G/NP0

X7R

C0G/NP0

X7R

150pF

15nF

120pF

12nF

10pF - 100pF

150pF - 10nF

560pF - 820pF

56nF - 68nF

390pF - 470pF

18nF - 47nF

10pF - 330pF

470pF - 15nF

0603

1.6±0.2

(0.063±0.008)

0.8±0.2

(0.03±0.008)

0.5±0.15

(0.02±0.006)

0.4±0.15

(0.016±0.006)

0.25±0.15

(0.010±0.006)

E03

0603

0805

1206

1410

1812

2220

Minimum and maximum capacitance values

1.8nF - 3.3nF

1.2nF - 1.5nF

56nF - 220nF

22pF - 1.0nF

1.5nF - 47nF

22pF - 1.0nF

820pF - 33nF

0805

2.0±0.3

(0.08±0.012)

1.25±0.2

(0.05±0.008)

1.0±0.15

(0.04±0.006)

0.5±0.25

(0.02±0.01)

0.3±0.15

(0.012±0.006)

6.8nF - 8.2nF

470nF

4.7nF - 5.6nF

180nF - 400nF

100pF - 3.9nF

4.7nF - 150nF

100pF - 3.3nF

1.2nF - 120nF

1206

3.2±0.3

(0.126±0.012)

1.60±0.2

(0.063±0.008)

1.1±0.2

(0.043±0.008)

0.95±0.3

(0.037±0.012)

0.5±0.25

(0.02±0.01)

12nF - 15nF

820nF

8.2nF - 10nF

390nF - 680nF

820pF - 6.8nF

8.2nF - 330nF

820pF - 5.6nF

2.7nF - 180nF

820pF - 3.9nF

2.7nF - 100nF

1410

3.6±0.3

(0.14±0.012)

2.5±0.3

(0.1±0.012)

2.0 max.

(0.08 max.)

1.20±0.3

(0.047±0.012)

0.5±0.25

(0.02±0.01)

22nF - 33nF

1.2µF

18nF

560nF - 1.0µF

1.0nF - 15nF

10nF - 470nF

1.0nF - 15nF

4.7nF - 470nF

1.0nF - 10nF

4.7nF - 180nF

2220

5.7±0.4

(0.22±0.016)

5.0±0.4

(0.2±0.016)

2.5 max.

(0.1 max.)

2.25±0.4

(0.09±0.016)

0.75±0.25

(0.03±0.01)

Notes: 1) For some lower capacitance parts, higher voltage

rated parts may be supplied.

1812

4.5±0.35

(0.18±0.014)

3.2±0.3

(0.126±0.012)

2.1 max.

(0.08 max.)

1.4±0.35

(0.06±0.014)

0.75±0.25

(0.03±0.01)

Notes: 1) All dimensions mm (inches).

2) Pad widths less than chip width gives improved mechanical performance.

3) The solder stencil should place 4 discrete solder pads. The un-printed distance between

ground pads is shown as dim E.

4) Insulating the earth track underneath the filters is acceptable and can help avoid

displacement of filter during soldering

but can result in residue entrapment under the chip.

Recommended solder lands

0603

0.6 (0.024)

0.4 (0.016)

0.2 (0.008)

0.4 (0.016)

0805

0.95 (0.037)

0.9 (0.035)

0.3 (0.012)

0.4 (0.016)

0.75 (0.030)

1206

1.2 (0.047)

0.9 (0.035)

0.6 (0.024)

0.8 (0.031 )

1.0 (0.039)

1410

2.05 (0.08)

1.0 (0.040)

0.7 (0.028)

0.9 (0.035)

1.85 (0.071)

1812

2.65 (0.104)

1.4 (0.055)

0.8 (0.031)

1.4 (0.055)

2.05 (0.080)

2220

4.15 (0.163)

1.4 (0.055)

1.2 (0.047)

1.8 (0.071)

3.95 (0.156)

1206H1000473MXRE03

1206H1000473MXRE03概述

1206H1000473MXRE03规格参数

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