Series 218 SMT DIP
®
SMT Half Pitch DIP
Switch–Auto
Placeable
Features
Optimized Mechanical Features
• Removable tape seal to withstand IR vapor phase
or wave soldering temperatures and board washing
• Gull-wing and "J" bend terminal configurations
• Low profile actuators prevent accidental actuation
• SPST configuration available
Optimized Contact System
• Redundant, wiping contact
• Contactor does not deflect during actuation
• 0.6 mm/.024" actuator travel
Materials
•
•
•
•
Gold plated beryllium copper contacts
Gold flash coated terminals
High temperature materials (UL94V-0)
RoHS Compliant
Electrical and Mechanical Specifications
Sw i t c h Fu n c t i o n
SPST - 2, 4, 6, 8, 12 positions
Sw i t c h Co n t ac t Res i s t an ce
100 milliohms maximum initial
100 milliohms maximum at end of life
In s u l at i o n Res i s t an c e
100 megohms minimum between
insulated terminals
Di el ec t r i c St r en g t h
350 VAC for 1 minute between
adjacent swithces
No n s w i t c h i n g Rat i n g
100 mA or 50 VDC maximum
Sw i t c h Cap ac i t an c e
10 pF maximum between adjacent
closed switches
Op er at i n g Tem p er at u r e
- 55°C to +85°C
A c t u at i o n L i f e
1,000 cycles switching 25 mA @ 24 VDC
Co p l an ar i t y
Coplanarity of 0.1mm/.004" maximum
Allowable Solder Time
Up to 60 seconds at 260°C
Vi b r at i o n
Per MIL-STD-202G, method 204D, condition B
(.06" or 15G’s between 10 HZ to 2 KHz) with
no contact inconsistencies greater than 1
microsecond.
Sh o c k
Per MIL-STD-202G, method 213B, condition A
(50G’s) with no contact inconsistencies greater
than 1 microsecond.
Seal i n g
Standard bottom seal
Optional top tape seal
Mar k i n g
Special marking available-consult CTS
Packaging
Standard : Anti-static tube packaging
Optional : Tape and reel packaging
1-2
CTS Electronic Components
© 2008 CTS Corporation. All rights reserved. Information subject to change.
www.ctscorp.com
2/19/08
Microchip MCU
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