Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PDIP40, PLASTIC, DIP-40
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP40,.6 |
| 针数 | 40 |
| Reach Compliance Code | unknown |
| 具有ADC | NO |
| 地址总线宽度 | 16 |
| 位大小 | 8 |
| CPU系列 | Z8 |
| 最大时钟频率 | 12 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-PDIP-T40 |
| JESD-609代码 | e0 |
| I/O 线路数量 | 32 |
| 端子数量 | 40 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 236 |
| ROM（单词） | 4096 |
| ROM可编程性 | MROM |
| 速度 | 12 MHz |
| 最大压摆率 | 30 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Z86C1112PSCRXXX | Z86C1112VSCRXXX | Z86C1116FSCRXXX | Z86C1116PSCRXXX | Z86C1112FSCRXXX | Z86C1112VECRXXX | Z86C1112PECRXXX | |
|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PDIP40, PLASTIC, DIP-40 | Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, MROM, Z8 CPU, 16MHz, CMOS, PQFP44, PLASTIC, QFP-44 | Microcontroller, 8-Bit, MROM, Z8 CPU, 16MHz, CMOS, PDIP40, PLASTIC, DIP-40 | Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PQFP44, PLASTIC, QFP-44 | Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, MROM, Z8 CPU, 12MHz, CMOS, PDIP40, PLASTIC, DIP-40 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | LCC | QFP | DIP | QFP | LCC | DIP |
| 包装说明 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | PLASTIC, QFP-44 | PLASTIC, DIP-40 | QFP, FL(UNSPEC) | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 |
| 针数 | 40 | 44 | 44 | 40 | 44 | 44 | 40 |
| Reach Compliance Code | unknown | unknown | unknow | unknow | unknow | unknow | unknown |
| 具有ADC | NO | NO | NO | NO | NO | NO | NO |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 |
| 最大时钟频率 | 12 MHz | 12 MHz | 16 MHz | 16 MHz | 12 MHz | 12 MHz | 12 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-PDIP-T40 | S-PQCC-J44 | S-PQFP-G44 | R-PDIP-T40 | S-PQFP-G44 | S-PQCC-J44 | R-PDIP-T40 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| I/O 线路数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 40 | 44 | 44 | 40 | 44 | 44 | 40 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 105 °C | 105 °C |
| PWM 通道 | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCJ | QFP | DIP | QFP | QCCJ | DIP |
| 封装等效代码 | DIP40,.6 | LDCC44,.7SQ | FL(UNSPEC) | DIP40,.6 | FL(UNSPEC) | LDCC44,.7SQ | DIP40,.6 |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 236 | 236 | 236 | 236 | 236 | 236 | 236 |
| ROM（单词） | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM | MROM |
| 速度 | 12 MHz | 12 MHz | 16 MHz | 16 MHz | 12 MHz | 12 MHz | 12 MHz |
| 最大压摆率 | 30 mA | 35 mA | 35 mA | 35 mA | 35 mA | 35 mA | 35 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | GULL WING | THROUGH-HOLE | GULL WING | J BEND | THROUGH-HOLE |
| 端子位置 | DUAL | QUAD | QUAD | DUAL | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 端子节距 | 2.54 mm | 1.27 mm | - | 2.54 mm | - | 1.27 mm | 2.54 mm |
| 厂商名称 | - | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | - |
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