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TDA1308TT

产品描述Class AB stereo headphone driver
产品类别模拟混合信号IC    消费电路   
文件大小98KB,共19页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
标准
下载文档 详细参数 选型对比 全文预览

TDA1308TT概述

Class AB stereo headphone driver

TDA1308TT规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称NXP(恩智浦)
零件包装代码SOIC
包装说明TSSOP, TSSOP8,.19
针数8
Reach Compliance Codecompli
ECCN代码EAR99
其他特性IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY
标称带宽20 kHz
商用集成电路类型AUDIO AMPLIFIER
JESD-30 代码S-PDSO-G8
长度3 mm
信道数量2
功能数量1
端子数量8
最高工作温度85 °C
最低工作温度-40 °C
标称输出功率0.04 W
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP8,.19
封装形状SQUARE
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度)260
电源+-2.5/5 V
认证状态Not Qualified
座面最大高度1.1 mm
最大压摆率5 mA
最大供电电压 (Vsup)3.5 V
最小供电电压 (Vsup)1.5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
宽度3 mm

文档预览

下载PDF文档
TDA1308; TDA1308A
Class-AB stereo headphone driver
Rev. 04 — 25 January 2007
Product data sheet
1. General description
The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in
an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump
wafer level chip-size package (WLCSP8). The device is fabricated in a 1
µm
Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily
developed for portable digital audio applications.
The difference between the TDA1308 and the TDA1308A is that the TDA1308A can be
used at low supply voltages.
2. Features
I
I
I
I
I
I
Wide temperature range
No switch ON/OFF clicks
Excellent power supply ripple rejection
Low power consumption
Short-circuit resistant
High performance
N
High signal-to-noise ratio
N
High slew rate
N
Low distortion
I
Large output voltage swing
3. Quick reference data
Table 1.
Quick reference data
V
DD
= 5 V; V
SS
= 0 V; T
amb
= 25
°
C; f
i
= 1 kHz; R
L
= 32
; unless otherwise specified.
Symbol
V
DD
Parameter
supply voltage
Conditions
TDA1308
single supply
dual supply
TDA1308A
single supply
dual supply
V
SS
I
DD
negative supply
voltage
supply current
TDA1308; dual supply
TDA1308A; dual supply
no load
2.4
1.2
−1.5
−1.2
-
5.0
2.5
−2.5
−2.5
3
7.0
3.5
−3.5
−3.5
5
V
V
V
V
mA
3.0
1.5
5.0
2.5
7.0
3.5
V
V
Min
Typ
Max
Unit

TDA1308TT相似产品对比

TDA1308TT TDA1308T/N2/N,112 TDA1308T/N2/G,115 TDA1308T/N2/N,115 TDA1308T/N2/G,112 TDA1308T/N1/N,115 TDA1308T/N1,115 TDA1308T TDA1308A
描述 Class AB stereo headphone driver 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 Class AB stereo headphone driver Class AB stereo headphone driver
是否Rohs认证 符合 不符合 符合 不符合 符合 不符合 - 符合 -
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) - - -
零件包装代码 SOIC SOIC SOIC SOIC SOIC SOIC SOIC SOIC -
包装说明 TSSOP, TSSOP8,.19 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 PLASTIC, SO-8 SOP, SOP8,.25 -
针数 8 8 8 8 8 8 8 8 -
Reach Compliance Code compli unknow unknow unknow unknow unknow unknow compli -
其他特性 IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY - IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY -
标称带宽 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz - 20 kHz -
商用集成电路类型 AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER -
JESD-30 代码 S-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 -
长度 3 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm -
信道数量 2 2 2 2 2 2 2 2 -
功能数量 1 1 1 1 1 1 - 1 -
端子数量 8 8 8 8 8 8 8 8 -
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C -
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -
标称输出功率 0.04 W 0.04 W 0.04 W 0.04 W 0.04 W 0.04 W 0.06 W 0.04 W -
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
封装代码 TSSOP SOP SOP SOP SOP SOP SOP SOP -
封装等效代码 TSSOP8,.19 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25 -
封装形状 SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE -
电源 +-2.5/5 V 5 V 5 V 5 V 5 V 5 V 5 V +-2.5/5 V -
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
座面最大高度 1.1 mm 1.75 mm 1.75 mm 1.75 mm 1.75 mm 1.75 mm 1.75 mm 1.75 mm -
最大压摆率 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA -
最大供电电压 (Vsup) 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V -
最小供电电压 (Vsup) 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V -
表面贴装 YES YES YES YES YES YES YES YES -
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS -
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING -
端子节距 0.65 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm -
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL -
宽度 3 mm 3.9 mm 3.9 mm 3.9 mm 3.9 mm 3.9 mm 3.9 mm 3.9 mm -
Source Url Status Check Date - 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 - -
Brand Name - NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc - -
制造商包装代码 - SOT96-1 SOT96-1 SOT96-1 SOT96-1 SOT96-1 SOT96-1 - -
谐波失真 - 0.3% 0.3% 0.3% 0.3% 0.3% - 0.3% -
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