CYStech Electronics Corp.
Schottky Barrier Rectifiers
Reverse Voltage 20V to 60V Forward Current 1.0 Amperes
Spec. No. : C474LB
Issued Date : 2009.08.13
Revised Date :
Page No. : 1/3
SB120 thru SB160
Features
•
Metal semiconductor junction with guard ring
•
Epitaxial construction
•
Low forward voltage drop
•
High current capability
•
The plastic material carries UL recognition 94V-0
•
For use in low voltage, high frequency inverters, free wheeling,
and polarity protection applications
Outline
DO-204AL(DO-41)
Mechanical Characteristics:
•Case: JEDEC DO-204AL(DO-41) molded plastic
•Terminals: Tin plated axial leads, solderable per MIL-STD-202, method 208
•Polarity: Color band denotes cathode
•Mounting position: Any
•Weight : 0.012oz., 0.33grams
Maximum Ratings and Electrical Characteristics
(Rating
at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load. For
capacitive load, derate current by 20%)
Parameter
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum forward voltage at 1A
Maximum average forward rectified current
.375”(9.5mm) lead lengths @T
L
=100
°
C
Peak forward surge current @8.3ms single half
sine wave superimposed on rated load (JEDEC
method)
T
J
=25°C
Maximum DC reverse current at
rated DC blocking voltage
T
J
=100°C
Typical thermal resistance
(Note 1)
Typical junction capacitance
(Note 2)
Operating junction temperature range
Storage temperature range
Symbol
V
RRM
V
RMS
V
DC
V
F
I
F(AV)
I
FSM
I
R
R
θJL
C
J
T
J
T
STG
Type
Units
SB120 SB130 SB140 SB150 SB160
20
30
40
50
60
V
14
21
28
35
42
V
20
30
40
50
60
V
0.5
0.70
V
1
40
0.5
10
15
150
-55 ~ +125
-55 ~ +150
A
A
mA
°
C/W
pF
°
C
°
C
Note: 1.Thermal resistance, junction to lead.
2.Measured at 1.0MHz and applied reverse voltage of 4.0V
DC
SB120 thru SB160
CYStek Product Specification
CYStech Electronics Corp.
DO-204AL(DO-41) Dimension
Spec. No. : C474LB
Issued Date : 2009.08.13
Revised Date :
Page No. : 3/3
DO-204AL(DO-41) Molded Plastic Package
CYStek Package Code: LB
DIM
A
B
C
Inches
Min.
Max.
ϕ0.0280 ϕ0.0339
1.0000
-
0.1654
0.2047
Millimeters
Min.
Max.
ϕ0.71
ϕ0.86
25.40
-
4.20
5.20
DIM
D
E
Inches
Min.
Max.
1.0000
-
ϕ0.0787 ϕ0.1063
Millimeters
Min.
Max.
25.40
-
ϕ2.00
ϕ2.70
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.
•
Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SB120 thru SB160
CYStek Product Specification
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