4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm
Product Features:
Low Cost SMD Package
Ultra Miniature Package
Compatible with Leadfree Processing
ILCX19 Series
Applications:
Fibre Channel
Server & Storage
Sonet /SDH
802.11 / Wifi
T1/E1, T3/E3
1.6
+/-0.1
2.0
+/-0.1
4
3
1
2
Frequency
ESR (Equivalent Series Resistance)
16.0 MHz – 23.9 MHz
24.0 MHz – 25.9 MHz
26.0 MHz – 39.9 MHz
40.0 MHz – 60.0 MHz
24 MHz to 60 MHz
0.45
+/-0.1
150
Max.
80
Max.
60
Max.
60
Max.
1
2
4
3
Shunt Capacitance (C0)
Frequency Tolerance @ 25
C
Frequency Stability over
Temperature
Crystal Cut
Load Capacitance
Drive Level
Aging
Temperature
Operating
Storage
3 pF Max.
30
ppm Standard (see Part Number Guide for more options)
50
ppm Standard (see Part Number Guide for more options)
AT Cut
18 pF Standard
100 µW Max.
5
ppm Max. / Year Standard
1.05
Connection diagram
4
3
1
2
Recommended pad layout
0.85
0.75
0 C to +70 C Standard (see Part Number Guide for more
options)
1.25
-40 C to +85 C Standard
Dimension Units: mm
Part Number Guide
Package
Tolerance
(ppm) at Room
Temperature
B = ±50 ppm
F = ±30 ppm
ILCX19 -
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm
J = ±10 ppm*
Sample Part Number:
Stability
(ppm) over Operating
Temperature
B = ±50 ppm
F = ±30 ppm
G = ±25 ppm
H = ±20 ppm
I = ±15 ppm**
J = ±10 ppm**
ILCX19 - FB1F18 - 20.000
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
F = Fundamental
18 pF Standard
Or Specify
- 20.000 MHz
Mode
(overtone)
Load Capacitance
(pF)
Frequency
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
12/20/12_C
Specifications subject to change without notice
Page 1
4 Pad Ceramic Package Quartz Crystal, 1.6 mm x 2 mm
Pb Free Solder Reflow Profile:
Typical Circuit:
ILCX19 Series
*Units are backward compatible with 240C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metal).
Tape and Reel Information:
Quantity per
Reel
A
B
C
D
E
F
3000
8 +/-.3
4 +/-.2
3.5 +/-.2
9 +/-1 or 12 +/-3
60 / 80
180
Environmental Specifications
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking
Line 1: I, Date Code (yww)
ILSI
America
Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: e-mail@ilsiamerica.com • www.ilsiamerica.com
12/20/12_C
Specifications subject to change without notice
Page 2
Microchip MCU
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