电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HLMP-6620-F001S

产品描述Subminiature LED Lamps
产品类别光电子/LED    光电   
文件大小238KB,共16页
制造商AVAGO
官网地址http://www.avagotech.com/
标准
下载文档 详细参数 全文预览

HLMP-6620-F001S在线购买

供应商 器件名称 价格 最低购买 库存  
HLMP-6620-F001S - - 点击查看 点击购买

HLMP-6620-F001S概述

Subminiature LED Lamps

HLMP-6620-F001S规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明PLASTIC PACKAGE-2
Reach Compliance Codecompli
ECCN代码EAR99
Factory Lead Time17 weeks
其他特性TTL COMPATIBLE
颜色HIGH EFFICIENCY RED
颜色@波长Orange-Red
配置SINGLE WITH BUILT-IN RESISTOR
最大正向电流0.03 A
最大正向电压3 V
JESD-609代码e3
透镜类型DIFFUSED
标称发光强度2.0 mcd
安装特点AXIAL MOUNT
功能数量1
端子数量2
最高工作温度85 °C
最低工作温度-40 °C
光电设备类型SINGLE COLOR LED
总高度2.92 mm
包装方法BULK
峰值波长635 nm
最大反向电压5 V
形状ROUND
尺寸1.78 mm
表面贴装NO
T代码T-3/4
端子面层Tin (Sn)
端子节距2.54 mm
视角90 deg
Base Number Matches1

文档预览

下载PDF文档
HLMP-Pxxx Series, HLMP-Qxxx Series
HLMP-6xxx Series, HLMP-70xx Series
Subminiature LED Lamps
Data Sheet
Description
Flat Top Package
The HLMP-Pxxx Series flat top lamps use an untinted, non-
diffused, truncated lens to provide a wide radiation pat-
tern that is necessary for use in backlighting applications.
The flat top lamps are also ideal for use as emitters in light
pipe applications.
Features
Subminiature flat top package
– ideal for backlighting and light piping applications
Subminiature dome package
– diffused dome for wide viewing angle
– nondiffused dome for high brightness
TTL and LSTTL compatible 5 volt resistor lamps
Available in six colors
Ideal for space limited applications
Axial leads
Available with lead configurations for surface mount
and through hole PC board mounting
Dome Packages
The HLMP-6xxx Series dome lamps for use as indicators
use a tinted, diffused lens to provide a wide viewing angle
with a high on-off contrast ratio. High brightness lamps
use an untinted, nondiffused lens to provide a high lumi-
nous intensity within a narrow radiation pattern.
Resistor Lamps
The HLMP-6xxx Series 5 volt subminiature lamps with
built in current limiting resistors are for use in applications
where space is at a premium.
Lead Configurations
All of these devices are made by encapsulating LED chips
on axial lead frames to form molded epoxy subminiature
lamp packages. A variety of package configuration op-
tions is available. These include special surface mount
lead configurations, gull wing, yoke lead or Z-bend. Right
angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm
(0.200 inch) center spacing are available for through hole
mounting. For more information refer to Standard SMT
and Through Hole Lead Bend Options for Subminiature
LED Lamps data sheet.

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1492  115  1156  2793  114  33  30  29  12  32 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved