HCPL-M700/HCPL-M701
Small Outline, 5 Lead, Low Input Current, High Gain Optocouplers
Data Sheet
Description
These small outline, low input current, high gain
optocouplers are single channel devices in a five lead
miniature footprint. They are electrically equivalent
to the following Avago optocouplers:
The SO-5 JEDEC registered (MO-155) package outline
does not require “through holes” in a PCB. This
package occupies approximately one-fourth the
footprint area of the standard dual-in-line package.
The lead profile is designed to be compatible with
standard surface mount processes.
Features
• Surface mountable
• Very small, low profile JEDEC registered package outline
• Compatible with infrared vapor phase reflow and wave
soldering processes
• High current transfer ratio: 2000%
• Low input current capability: 0.5 mA
• TTL compatible output: V
OL
= 0.1 V
• Guaranteed ac and dc performance over temperature:
0°C to 70°C
• High output current: 60 mA
• Recognized under the component program of U.L. (file No.
E55361) for dielectric withstand proof test voltage of 3750
Vac, 1 minute
• Lead free option “-000E”
These high gain series opto-couplers use a Light
Emitting Diode and an integrated high gain photo-
detector to provide extremely high current transfer
ratio between input and output. Separate pins for
the photodiode and output stage results in TTL
compatible saturation voltages and high speed
Applications
operation. Where desired the V
CC
and V
O
terminals
• Ground isolate most logic families: TTL/TTL, CMOS/TTL,
CMOS/CMOS, LSTTL/TTL, CMOS/LSTTL
may be tied together to achieve conventional photo-
darlington operation.
• Low input current line receiver
• EIA RS232C line receiver
The HCPL-M701 is for use in CMOS, LSTTL or other
• Telephone ring detector
low power applications. A 400% minimum current
• ac line voltage status indicator:
transfer ratio is guaranteed over a 0-70°C operating
low input power dissipation
range for only 0.5 mA of LED current.
• Low power systems: ground isolation
The HCPL-M700 is designed for use mainly in TTL
applications. Current Transfer Ratio is 300%
minimum over 0-70C for an LED current of 1.6 mA
°
[1 TTL Unit Load (U.L.)]. A 300% CTR enables operation
with 1 U.L. out with a 2.2 kΩ pull-up resistor.
Selection for lower input currents down to 250
µA
is
available upon request.
SO-5 Package
HCPL-M700
HCPL-M701
Standard DIP
6N138
6N139
SO-8 Package
HCPL-0700
HCPL-0701
CAUTION: The small device geometries inherent to the design of this bipolar component increase the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in
handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
HCPL-M700 and HCPL-M701 are UL Recognized with 3750 V
rms
for 1 minute per UL1577 and are approved
under CSA Component Acceptance Notice #5, File CA 88324.
Option
RoHS
Non RoHS
Compliant
Compliant
-000E
-500E
No option
#500
Part
Number
HCPL-M700
HCPL-M701
Package
SO-5
Surface
Mount
X
Gull
Wing
X
Tape &
Reel
X
Quantity
100 per tube
1500 per reel
To order, choose a part number from the part number column and combine with the desired option from the
option column to form an order entry.
Example 1:
HCPL-M700-500E to order product of Mini-flat Surface Mount 5-pin package in Tape and Reel packaging
with RoHS compliant.
Example 2:
HCPL-M700 to order product of Mini-flat Surface Mount 5-pin package in tube packaging and non RoHS
compliant.
Option data sheets are available. Contact your Avago sales representative or authorized distributor for
information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15
th
July
2001 and RoHS compliant option will use ‘-XXXE‘.
Outline Drawing (JEDEC MO-155)
ANODE 1
4.4 ± 0.1
(0.173 ± 0.004)
6
V
CC
MXXX
XXX
7.0 ± 0.2
(0.276 ± 0.008)
CATHODE 3
5 V
OUT
4
GND
0.4 ± 0.05
(0.016 ± 0.002)
3.6 ± 0.1*
(0.142 ± 0.004)
0.102 ± 0.102
(0.004 ± 0.004)
0.15 ± 0.025
(0.006 ± 0.001)
7° MAX.
1.27 BSC
(0.050)
0.71 MIN.
(0.028)
MAX. LEAD COPLANARITY
= 0.102 (0.004)
DIMENSIONS IN MILLIMETERS (INCHES)
* MAXIMUM MOLD FLASH ON EACH SIDE IS 0.15 mm (0.006)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
2.5 ± 0.1
(0.098 ± 0.004)
2
Land Pattern Recommendation
4.4
(0.17)
Schematic
6
V
CC
I
CC
+
ANODE
2.5
(0.10)
1.3
(0.05)
I
F
1
V
F
CATHODE
–
3
I
O
5
V
O
2.0
(0.080)
8.27
(0.325)
0.64
(0.025)
4
GND
Absolute Maximum Ratings
(No Derating Required up to 85°C)
Storage Temperature ................................................... -55°C to +125°C
Operating Temperature ................................................. -40°C to +85°C
Average Input Current - I
F
.......................................................... 20 mA
Peak Input Current - I
F
............................................................... 40 mA
(50% duty cycle, 1 ms pulse width)
Peak Transient Input Current - I
F
................................................ 1.0 A
(≤1
µs
pulse width, 300 pps)
Reverse Input Voltage - V
R
............................................................... 5 V
Input Power Dissipation ............................................................. 35 mW
Output Current - I
O
(Pin 5) ......................................................... 60 mA
Supply and Output Voltage - V
CC
(Pin 6-4),V
O
(Pin 5-4)
HCPL-M700 .................................................................... -0.5 V to 7 V
HCPL-M701 .................................................................. -0.5 V to 18 V
Output Power Dissipation ........................................................ 100 mW
Infrared and Vapor Phase Reflow Temperature .................... see below
3
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
t
p
T
p
T
L
TEMPERATURE
T
smax
T
smin
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
t
L
60 to 150 SEC.
NOTES:
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
Note: Non-halide flux should be used.
Insulation Related Specifications
Parameter
Min. External Air Gap
(Clearance)
Min. External Tracking Path
(Creepage)
Min. Internal Plastic Gap
(Clearance)
Tracking Resistance
Isolation Group (per DIN VDE 0109)
Symbol
L(IO1)
L(IO2)
Value
≥
5
≥
5
0.08
CTI
175
IIIa
Units
mm
mm
mm
V
Conditions
Measured from input terminals
to output terminals
Measured from input terminals
to output terminals
Through insulation distance
conductor to conductor
DIN IEC 112/VDE 0303 Part 1
Material Group DIN VDE 0109
4
Electrical Specifications
Over recommended temperature (T
A
= 0°C to 70°C) unless otherwise specified. (See note 6.)
Parameter
Current
Transfer
Ratio
Symbol Device Min. Typ.* Max. Units
HCPL-
CTR
M701
400
500
M700
Logic Low
Output
Voltage
V
OL
M701
300
2000
1600
1600
0.1
0.1
0.2
M700
Logic High
Output
I
OH
M701
M700
Logic Low
Supply
Current
Logic High
Supply
Current
Input
Forward
Voltage
Input
Reverse
Breakdown
Voltage
Tempera-
ture Co-
efficient of
Forward
Voltage
Input
Capacitance
Input-
Output
Insulation
Resistance
(Input-
Output)
Capacitance
(Input-
Output)
I
CCL
0.1
0.05
0.1
0.4
3500
2600
2600
0.4
0.4
0.4
0.4
100
250
1.5
mA
µA
V
%
Test Conditions
I
F
= 0.5 mA, V
O
= 0.4 V,
V
CC
= 4.5 V
I
F
= 1.6 mA, V = 0.4 V,
V
CC
= 4.5 V
I
F
= 1.6 mA, V
O
= 0.4 V,
V
CC
= 4.5 V
I
F
= 1.6 mA, I
O
= 8 mA,
V
CC
= 4.5 V
I
F
= 5 mA, I
O
= 15 mA,
V
CC
= 4.5 V
I
F
= 12 mA, I
O
= 24 mA,
V
CC
= 4.5 V
I
F
= 1.6 mA, I
O
= 24 mA,
V
CC
= 4.5 V
I
F
= 0 mA,
V
O
= V
CC
= 18 V
I
F
= 0 mA,
V
O
= V
CC
= 7 V
I
F
= 1.6 mA, V
O
= Open,
V
CC
= 18 V
I
F
= 0 mA, V
O
= Open,
V
CC
= 18 V
T
A
= 25°C
I
F
= 1.6 mA
I
R
= 10
µA
4
1
Fig.
2, 3
Note
1
I
CCH
0.01
10
µA
V
F
1.4
1.7
1.75
V
BV
R
5
∆V
F
/∆T
A
-1.8
mV/°C
I
F
= 1.6 mA
C
IN
V
ISO
3750
60
pF
V
RMS
f = 1 MHz, V
F
= 0
RH
≤
50%, t = 1 min,
T
A
= 25°C
V
I-O
= 500 V
DC
2, 3
R
I-O
10
12
Ω
2
C
I-O
0.6
pF
f = 1 MHz
2
*All
5
typicals at T
A
= 25°C, V
CC
= 5 V.
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