HCPL-M456
Small Outline, 5 Lead Intelligent Power Module Optocoupler
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
The HCPL-M456 consists of a GaAsP LED optically coupled
to an integrated high gain photo detector. Minimized
propagation delay difference between devices make
these optocouplers excellent solutions for improving
inverter efficiency through reduced switching dead time.
Specifications and performance plots are given for typical
IPM applications.
Features
x
Performance specified for common IPM applications
over industrial temperature range: -40° C to 100° C
x
Fast maximum propagation delays
t
PHL
= 400 ns, t
PLH
= 550 ns
x
Minimized Pulse Width Distortion (PWD = 370 ns)
x
Very high Common Mode Rejection (CMR):
15 kV/Ps at V
CM
= 1500 V
x
CTR > 44% at I
F
= 10 mA
x
Safety approval
UL recognized per UL1577 (file no. E55361)
– 3750Vms for 1 minute
Schematic Diagram
1
6
Truth Table
5
x
Lead free option “-000E”
LED
ON
OFF
V
O
L
H
Applications
x
IPM isolation
x
Isolated IGBT/MOSFET gate drive
x
AC and brushless dc motor drives
x
Industrial inverters
3
SHIELD
4
The connection of a 0.1
PF
bypass capacitor between pins 4 and 6 is recommended.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
HCPL-M456 is UL Recognized with 3750 Vrms for 1 minute per UL1577.
Option
Part number
HCPL-M456
RoHS
Compliant
-000E
-500E
-060E
-560E
Non RoHS
Compliant
No option
#500
-060
-560
Package Surface Mount
SO-5
X
X
X
X
Tape
& Reel
X
IEC/EN/DIN
EN 60747-5-2 Quantity
100 per tube
1500 per reel
X
100 per tube
1500 per reel
X
X
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-M456-560E to order product of SO-5 Surface Mount package in Tape and Reel packaging with IEC/EN/DIN EN
60747-5-2 Safety Approval in RoHS compliant.
Example 2:
HCPL-M456 to order product of SO-5 Surface Mount package in tube packaging and non RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and RoHS
compliant option will use ‘-XXXE‘.
HCPL-M456 Outline Drawing
Pin Location (for reference only)
ANODE
4.4 ± 0.1
(0.173 ± 0.004)
1
6
5
V
CC
V
OUT
GND
MXXX
XXX
7.0 ± 0.2
(0.276 ± 0.008)
CATHODE
3
4
TYPE NUMBER (LAST 3 DIGITS)
DATE CODE
3.6 ± 0.1*
(0.142 ± 0.004)
0.4 ± 0.05
(0.016 ± 0.002)
2.5 ± 0.1
(0.098 ± 0.004)
0.102 ± 0.102
(0.004 ± 0.004)
0.15 ± 0.025
(0.006 ± 0.001)
7° MAX.
1.27 BSC
(0.050)
0.71 MIN
(0.028)
MAX. LEAD COPLANARITY
= 0.102 (0.004)
Dimensions in millimeters (inches)
* Maximum mold flash on each side is 0.15 mm (0.006)
Note: Floating lead protrusion is 0.15 mm (6 mils) max.
2
Land Pattern Recommendation
4.4
(0.17)
2.5
(0.10)
1.3
(0.05)
2.0
(0.080)
8.27
(0.325)
DIMENSION IN MILLIMETERS (INCHES)
Figure 1. 5 Pin SOIC Package (JEDEC MO-155) Device Outline Drawing.
0.64
(0.025)
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Average Input Current
[1]
Peak Input Current
[2]
(50% duty cycle, <1
Ps
pulse width)
Peak Transient Input Current
(<1
Ps
pulse width, 300 pps)
Reverse Input Voltage (Pin 3-1)
Average Output Current (Pin 5)
Output Voltage (Pin 5-4)
Supply Voltage (Pin 6-4)
Output Power Dissipation
[3]
Total Power Dissipation
[4]
Infrared and Vapor Phase Reflow Temperature
Symbol
T
S
T
A
I
F(avg)
I
F(peak)
I
F(tran)
V
R
I
O(avg)
V
O
V
CC
P
O
P
T
Min.
-55
-40
Max.
125
100
25
50
1.0
5
15
Units
°C
°C
mA
mA
A
Volts
mA
Volts
Volts
mW
mW
-0.5
-0.5
30
30
100
145
See Reflow Thermal Profile below.
3
Solder Reflow Thermal Profile
300
PREHEATING RATE 3° C + 1° C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5° C ± 0.5°C/SEC.
PEAK
TEMP.
245° C
PEAK
TEMP.
240° C
PEAK
TEMP.
230° C
TEMPERATURE (°C)
200
160° C
150° C
140° C
2.5° C ± 0.5°C/SEC.
30
SEC.
3° C + 1° C/–0.5° C
30
SEC.
SOLDERING
TIME
200°C
100
PREHEATING TIME
150° C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
TIME (SECONDS)
150
200
250
Note: Non-halide flux should be used.
Recommended Pb-Free IR Profile
t
p
T
p
T
L
217° C
TEMPERATURE
T
smax
T
smin
150 - 200° C
260 +0/-5° C
RAMP-UP
3°C/SEC. MAX.
TIME WITHIN 5° C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
RAMP-DOWN
6°C/SEC. MAX.
t
s
PREHEAT
60 to 180 SEC.
25
t 25° C to PEAK
TIME
t
L
60 to 150 SEC.
NOTES:
THE TIME FROM 25° C to PEAK
TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200° C, T
smin
= 150° C
Note: Non-halide flux should be used.
Recommended Operating Conditions
Parameter
Power Supply Voltage
Output Voltage
Input Current (ON)
Input Voltage (OFF)
Operating Temperature
Symbol
V
CC
V
O
I
F(on)
V
F(off )
T
A
Min.
4.5
0
10
-5
-40
Max.
30
30
20
0.8
100
Units
Volts
Volts
mA
V
°C
4
Insulation Related Specifications
Parameter
Minimum External Air Gap
External Clearance
Minimum External Tracking
External Creepage
Minimum Internal Plastic
Gap Internal Clearance
Tracking Resistance
Isolation Group
CTI
Symbol
L(101)
L(102)
Value
≥5
≥5
0.08
200
IIIa
Units
mm
mm
mm
Volts
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Insulation thickness between emitter and detector;
also known as distance through insulation.
DIN IEC 112/VDE 0303 Part 1
Material Group DIN VDE 0110
Regulatory Notes
x
The HCPL-M456 is recognized under the component program of U.L. (File No. 55361) for dielectric withstand proof
voltages of 2500 V
RMS
, 1 minute.
Electrical Specifications
Over recommended operating conditions unless otherwise specified:
T
A
= -40° C to +100° C, V
CC
= +4.5 V to 30 V, I
F(on)
= 10 mA to 20 mA, V
F(off )
= -5 V to 0.8 V
Parameter
Current Transfer Ratio
Low Level Output Current
Low Level Output Voltage
Input Threshold Current
High Level Output Current
High Level Supply Current
Low Level Supply Current
Input Forward Voltage
Temperature Coefficient of
Forward Voltage
Input Reverse Breakdown
Voltage
Input Capacitance
Input-Output Insulation
Voltage
Resistance (Input - Output)
Capacitance (Input - Output)
*All typical values at 25° C, V
CC
= 15 V.
Symbol
CTR
I
OL
V
OL
I
TH
I
OH
I
CCH
I
CCL
V
F
'V
F
/'T
A
BV
R
C
IN
V
ISO
R
I-O
C
I-O
Min.
44
4.4
Typ.*
90
9.0
0.3
1.5
5
0.6
0.6
1.5
-1.6
Max.
Units
%
mA
Test Conditions
I
F
= 10 mA, V
O
= 0.6 V
I
F
= 10 mA, V
O
= 0.6 V
I
O
= 2.4 mA
Fig.
2,3
Note
5
0.6
5.0
50
1.3
1.3
1.8
V
mA
PA
mA
mA
V
mV/°C
V
V
O
= 0.8 V, I
O
= 0.75 mA 2
V
F
= 0.8 V
V
F
= 0.8 V, V
O
= Open
I
F
= 10 mA, V
O
= Open
I
F
= 10 mA
I
F
= 10 mA
I
R
= 10
PA
f = 1 MHz, V
F
= 0 V
RH < 50%, t = 1 min,
T
A
= 25° C
V
I-O
= 500 Vdc
f = 1 MHz
5
4
9
9
9
5
60
3750
10
12
0.6
pF
V
RMS
:
pF
6, 7
6
6
5
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