IC,OP-AMP,QUAD,BIPOLAR/JFET,DIP,14PIN,CERAMIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | DIP |
包装说明 | DIP, DIP14,.3 |
针数 | 14 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK |
25C 时的最大偏置电流 (IIB) | 0.0004 µA |
频率补偿 | YES |
最大输入失调电压 | 20000 µV |
JESD-30 代码 | R-XDIP-T14 |
JESD-609代码 | e0 |
低-偏置 | YES |
低-失调 | NO |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 4 |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | +-15 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | NO |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
HA1-5084-7 | HA1-5084-8 | HA1-5084-5 | HA1-5084-2 | HA3-5084-7 | |
---|---|---|---|---|---|
描述 | IC,OP-AMP,QUAD,BIPOLAR/JFET,DIP,14PIN,CERAMIC | IC,OP-AMP,QUAD,BIPOLAR/JFET,DIP,14PIN,CERAMIC | IC,OP-AMP,QUAD,BIPOLAR/JFET,DIP,14PIN,CERAMIC | HA1-5084-2 | IC,OP-AMP,QUAD,BIPOLAR/JFET,DIP,14PIN,PLASTIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | DIP | DIP | DIP | DIP |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
针数 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
25C 时的最大偏置电流 (IIB) | 0.0004 µA | 0.0002 µA | 0.0004 µA | 0.0002 µA | 0.0004 µA |
频率补偿 | YES | YES | YES | YES | YES |
最大输入失调电压 | 20000 µV | 8000 µV | 20000 µV | 8000 µV | 20000 µV |
JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
低-偏置 | YES | YES | YES | YES | YES |
低-失调 | NO | NO | NO | NO | NO |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
功能数量 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 125 °C | 70 °C | 125 °C | 70 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | NO | NO | NO | NO | NO |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - |
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