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FM24C64C

产品描述SPECIALTY MEMORY CIRCUIT, PDSO8
产品类别存储   
文件大小224KB,共12页
制造商Ramtron International Corporation (Cypress Semiconductor Corporation)
官网地址http://www.cypress.com/
下载文档 详细参数 选型对比 全文预览

FM24C64C概述

SPECIALTY MEMORY CIRCUIT, PDSO8

专用存储器电路, PDSO8

FM24C64C规格参数

参数名称属性值
功能数量1
端子数量8
最大工作温度85 Cel
最小工作温度-40 Cel
最大供电/工作电压5.5 V
最小供电/工作电压4.5 V
额定供电电压5 V
加工封装描述绿色, MS-012AA, SOIC-8
无铅Yes
欧盟RoHS规范Yes
状态DISCONTINUED
包装形状矩形的
包装尺寸SMALL OUTLINE
表面贴装Yes
端子形式GULL WING
端子间距1.27 mm
端子涂层
端子位置
包装材料塑料/环氧树脂
温度等级INDUSTRIAL
内存宽度8
组织8K × 8
存储密度65536 deg
操作模式同步
位数8192 words
位数8K
内存IC类型内存 电路

文档预览

下载PDF文档
Preliminary
FM24C64C
64Kb Serial 5V F-RAM Memory
Features
64K bit Ferroelectric Nonvolatile RAM
Organized as 8,192 x 8 bits
High Endurance 1 Trillion (10
12
) Read/Writes
36 Year Data Retention at +75C
NoDelay™ Writes
Advanced High-Reliability Ferroelectric Process
Fast Two-wire Serial Interface
Up to 1 MHz maximum bus frequency
Direct hardware replacement for EEPROM
Supports legacy timing for 100 kHz & 400 kHz
Low Power Operation
5V operation
100
A
Active Current (100 kHz)
4
A
(typ.) Standby Current
Industry Standard Configuration
Industrial Temperature -40 C to +85 C
8-pin “Green”/RoHS SOIC (-G)
Description
The FM24C64C is a 64-kilobit nonvolatile memory
employing an advanced ferroelectric process. A
ferroelectric random access memory or FRAM is
nonvolatile and performs reads and writes like a
RAM. It provides reliable data retention for 36 years
while eliminating the complexities, overhead, and
system level reliability problems caused by
EEPROM and other nonvolatile memories.
The FM24C64C performs write operations at bus
speed. No write delays are incurred. Data is written to
the memory array in the cycle after it has been
successfully transferred to the device. The next bus
cycle may commence immediately without the need
for data polling. The FM24C64C is capable of
supporting 10
12
read/write cycles, or a million times
more write cycles than EEPROM.
These capabilities make the FM24C64C ideal for
nonvolatile memory applications requiring frequent
or rapid writes. Examples range from data collection
where the number of write cycles may be critical, to
demanding industrial controls where the long write
time of EEPROM can cause data loss. The
combination of features allows more frequent data
writes with less overhead for the system.
The FM24C64C provides substantial benefits to users
of serial EEPROM, yet these benefits are available in
a hardware drop-in replacement. The FM24C64C is
available in an industry standard 8-pin SOIC package
and uses a familiar two-wire protocol. The
specifications are guaranteed over an industrial
temperature range of -40°C to +85°C.
Pin Configuration
A0
A1
A2
VSS
1
2
3
4
8
7
6
5
VDD
WP
SCL
SDA
Pin Names
A0-A2
SDA
SCL
WP
VSS
VDD
Function
Device Select Address
Serial Data/address
Serial Clock
Write Protect
Ground
Supply Voltage
Ordering Information
FM24C64C-G
FM24C64C-GTR
“Green”/RoHS 8-pin SOIC
“Green”/RoHS 8-pin SOIC,
Tape & Reel
This is a product that has fixed target specifications but are subject
to change pending characterization results.
Rev. 1.1
June 2011
Ramtron International Corporation
1850 Ramtron Drive, Colorado Springs, CO 80921
(800) 545-FRAM, (719) 481-7000
www.ramtron.com
Page 1 of 12

FM24C64C相似产品对比

FM24C64C FM24C64C-G FM24C64C-GTR
描述 SPECIALTY MEMORY CIRCUIT, PDSO8 SPECIALTY MEMORY CIRCUIT, PDSO8 SPECIALTY MEMORY CIRCUIT, PDSO8
功能数量 1 1 1
端子数量 8 8 8
表面贴装 Yes YES YES
端子形式 GULL WING GULL WING GULL WING
端子位置 DUAL DUAL
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
内存宽度 8 8 8
组织 8K × 8 8KX8 8KX8
是否无铅 - 不含铅 不含铅
是否Rohs认证 - 符合 符合
厂商名称 - Ramtron International Corporation (Cypress Semiconductor Corporation) Ramtron International Corporation (Cypress Semiconductor Corporation)
零件包装代码 - SOIC SOIC
包装说明 - SOP, SOP8,.25 SOP, SOP8,.25
针数 - 8 8
Reach Compliance Code - unknow unknow
JESD-30 代码 - R-PDSO-G8 R-PDSO-G8
JESD-609代码 - e3 e3
长度 - 4.9 mm 4.9 mm
内存密度 - 65536 bi 65536 bi
内存集成电路类型 - MEMORY CIRCUIT MEMORY CIRCUIT
字数 - 8192 words 8192 words
字数代码 - 8000 8000
工作模式 - SYNCHRONOUS SYNCHRONOUS
最高工作温度 - 85 °C 85 °C
最低工作温度 - -40 °C -40 °C
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - SOP SOP
封装等效代码 - SOP8,.25 SOP8,.25
封装形状 - RECTANGULAR RECTANGULAR
封装形式 - SMALL OUTLINE SMALL OUTLINE
峰值回流温度(摄氏度) - NOT SPECIFIED NOT SPECIFIED
电源 - 5 V 5 V
认证状态 - Not Qualified Not Qualified
座面最大高度 - 1.75 mm 1.75 mm
最大待机电流 - 0.00001 A 0.00001 A
最大压摆率 - 0.0004 mA 0.0004 mA
最大供电电压 (Vsup) - 5.5 V 5.5 V
最小供电电压 (Vsup) - 4.5 V 4.5 V
标称供电电压 (Vsup) - 5 V 5 V
技术 - CMOS CMOS
端子面层 - TIN TIN
端子节距 - 1.27 mm 1.27 mm
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED
宽度 - 3.9 mm 3.9 mm

 
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