8-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | LLP-6 |
| Reach Compliance Code | _compli |
| 最大模拟输出电压 | 5.5 V |
| 最小模拟输出电压 | |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY |
| 输入格式 | SERIAL |
| JESD-30 代码 | R-XDSO-N6 |
| JESD-609代码 | e0 |
| 长度 | 2.5 mm |
| 最大线性误差 (EL) | 0.2344% |
| 湿度敏感等级 | 1 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVSON |
| 封装等效代码 | SOLCC6,.1,25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大稳定时间 | 4.5 µs |
| 标称安定时间 (tstl) | 3 µs |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 2.2 mm |
| Base Number Matches | 1 |
| DAC081C081CISD | DAC081C081 | DAC081C081CIMK | DAC081C081CIMKX | DAC081C081CISDX | DAC081C081_08 | DAC081C085CIMM | DAC081C085CIMMX | DAC081C08XEB | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 8-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface | 12-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface | 8-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface | 8-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface | 8-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface | 8-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface | 8-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface | 8-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface | 8-Bit Micro Power Digital-to-Analog Converter with an I2C-Compatible Interface |
| 是否Rohs认证 | 不符合 | - | 符合 | 符合 | 不符合 | - | 不符合 | 不符合 | - |
| 包装说明 | LLP-6 | - | VSSOP, TSOP6,.11,37 | VSSOP, TSOP6,.11,37 | LLP-6 | - | MSOP-8 | MSOP-8 | - |
| Reach Compliance Code | _compli | - | compli | compli | _compli | - | _compli | _compli | - |
| 最大模拟输出电压 | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | - |
| 转换器类型 | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | - |
| 输入位码 | BINARY | - | BINARY | BINARY | BINARY | - | BINARY | BINARY | - |
| 输入格式 | SERIAL | - | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL | - |
| JESD-30 代码 | R-XDSO-N6 | - | R-PDSO-G6 | R-PDSO-G6 | R-XDSO-N6 | - | S-PDSO-G8 | S-PDSO-G8 | - |
| JESD-609代码 | e0 | - | e4 | e4 | e0 | - | e0 | e0 | - |
| 长度 | 2.5 mm | - | 2.97 mm | 2.97 mm | 2.5 mm | - | 3 mm | 3 mm | - |
| 最大线性误差 (EL) | 0.2344% | - | 0.2344% | 0.2344% | 0.2344% | - | 0.2344% | 0.2344% | - |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | - |
| 位数 | 8 | - | 8 | 8 | 8 | - | 8 | 8 | - |
| 功能数量 | 1 | - | 1 | 1 | 1 | - | 1 | 1 | - |
| 端子数量 | 6 | - | 6 | 6 | 6 | - | 8 | 8 | - |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | - | 125 °C | 125 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | - |
| 封装主体材料 | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | HVSON | - | VSSOP | VSSOP | HVSON | - | TSSOP | TSSOP | - |
| 封装等效代码 | SOLCC6,.1,25 | - | TSOP6,.11,37 | TSOP6,.11,37 | SOLCC6,.1,25 | - | TSSOP8,.19 | TSSOP8,.19 | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | SQUARE | SQUARE | - |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 260 | - | 260 | 260 | - |
| 电源 | 3/5 V | - | 3/5 V | 3/5 V | 3/5 V | - | 3/5 V | 3/5 V | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
| 座面最大高度 | 0.8 mm | - | 1 mm | 1 mm | 0.8 mm | - | 1.09 mm | 1.09 mm | - |
| 最大稳定时间 | 4.5 µs | - | 4.5 µs | 5 µs | 4.5 µs | - | 4.5 µs | 4.5 µs | - |
| 标称安定时间 (tstl) | 3 µs | - | 3 µs | 3 µs | 3 µs | - | 3 µs | 3 µs | - |
| 标称供电电压 | 3 V | - | 3 V | 3 V | 3 V | - | 3 V | 3 V | - |
| 表面贴装 | YES | - | YES | YES | YES | - | YES | YES | - |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | - | CMOS | CMOS | - |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | - |
| 端子面层 | Tin/Lead (Sn85Pb15) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - |
| 端子形式 | NO LEAD | - | GULL WING | GULL WING | NO LEAD | - | GULL WING | GULL WING | - |
| 端子节距 | 0.65 mm | - | 0.95 mm | 0.95 mm | 0.65 mm | - | 0.65 mm | 0.65 mm | - |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | - | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | 40 | - | 40 | 40 | 40 | - | 40 | 40 | - |
| 宽度 | 2.2 mm | - | 1.65 mm | 1.65 mm | 2.2 mm | - | 3 mm | 3 mm | - |
| Base Number Matches | 1 | - | 1 | 1 | 1 | - | 1 | 1 | - |
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