Bus Driver, AUP/ULP/V Series, 2-Func, 1-Bit, True Output, CMOS, PBCC8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | X2SON-8 |
| Reach Compliance Code | compliant |
| 系列 | AUP/ULP/V |
| JESD-30 代码 | R-PBCC-B8 |
| 长度 | 1.35 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVBCC |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 传播延迟(tpd) | 24 ns |
| 座面最大高度 | 0.35 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | BUTT |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 0.8 mm |

| 74AUP2G125GX | 74AUP2G125DC | 74AUP2G125GT | 74AUP2G125GM | 74AUP2G125GN | 74AUP2G125GD | 74AUP2G125GF | 74AUP2G125GS | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, AUP/ULP/V Series, 2-Func, 1-Bit, True Output, CMOS, PBCC8 | Bus Driver, AUP/ULP/V Series, 2-Func, 1-Bit, True Output, CMOS, PDSO8 | Bus Driver, AUP/ULP/V Series, 2-Func, 1-Bit, True Output, CMOS, PDSO8 | Bus Driver, AUP/ULP/V Series, 2-Func, 1-Bit, True Output, CMOS, PBCC8 | Bus Driver, AUP/ULP/V Series, 2-Func, 1-Bit, True Output, CMOS, PDSO8 | Bus Driver, AUP/ULP/V Series, 2-Func, 1-Bit, True Output, CMOS, PDSO8 | Bus Driver, AUP/ULP/V Series, 2-Func, 1-Bit, True Output, CMOS, PDSO8 | Bus Driver, AUP/ULP/V Series, 2-Func, 1-Bit, True Output, CMOS, PDSO8 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | X2SON-8 | VSSOP, | VSON, | VBCC, | SON, | VSON, | VSON, | VSON, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 系列 | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V | AUP/ULP/V |
| JESD-30 代码 | R-PBCC-B8 | R-PDSO-G8 | R-PDSO-N8 | S-PBCC-B8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 | R-PDSO-N8 |
| 长度 | 1.35 mm | 2.3 mm | 1.95 mm | 1.6 mm | 1.2 mm | 3 mm | 1.35 mm | 1.35 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVBCC | VSSOP | VSON | VBCC | SON | VSON | VSON | VSON |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 传播延迟(tpd) | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns |
| 座面最大高度 | 0.35 mm | 1 mm | 0.5 mm | 0.5 mm | 0.35 mm | 0.5 mm | 0.5 mm | 0.35 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 标称供电电压 (Vsup) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | BUTT | GULL WING | NO LEAD | BUTT | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | BOTTOM | DUAL | DUAL | BOTTOM | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 0.8 mm | 2 mm | 1 mm | 1.6 mm | 1 mm | 2 mm | 1 mm | 1 mm |
| 厂商名称 | - | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| JESD-609代码 | - | e4 | e3 | e4 | e3 | e4 | e3 | e3 |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 端子面层 | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin (Sn) | Tin (Sn) |
| 端子节距 | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.3 mm | 0.5 mm | 0.35 mm | 0.35 mm |
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