OTQ - 64 - 0.8 -02
1
1.950"
2
3
5
Substrate: 0.0625"±0.007"
FR4/G10 or equivalent high
temp material. 1/2 oz. Cu clad.
SnPb plating
Pins: Material- Brass Alloy
360 1/2 hard; finish- 10µ" Au
over 50µ" Ni (min.).
Pins: shell material- Brass
Alloy 360 1/2 hard; finish-
10µ" Au over 50µ" Nil (min.).
Contact material- BeCu; finish
10µ" Au over 100µ" Ni (min.)
Test points: material-
Phosphor Bronze; plating- Sn
over 50µ" Ni. Gold flash on
contact end.
1
Top View
1.950"
5
0.977" assembled
0.200"
3
0.285" assembled
2
Surface-mountable
leadless (-L) foot.
.8mm
0.605"
Side View
(QFE64SA Foot Print Spec)
Description: Carrier Adaptor
64 position (0.8 mm pitch) QFP Zero Insertion Force socket with test points to 64 position surface mountable QFP emulator
foot. The 2 piece adaptor interconnects via gold plated (0.05" center) Mini-grid socket interface.
All tolerances are ±0.005" unless otherwise specified. Materials and specifications are subject to change without notice.
Target Board
Status: Released
CA-QFE64SA-L-Z-T-01 Drawing
64 Position QFP Land Pattern
© 1998 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
Tele: (651) 452-8100
www.ironwoodelectronics.com
www.ironwoodelectronics.com
(QFE64SA Foot Print Spec)
(QFE64SA Foot Print Spec) M Lund
© 1995 IRONWOOD ELECTRONICS, INC.
Drawing:
Scale 2:1
Rev: B
Date: 12/15/95
Modified: 7/9/98
File: CA-QFE064SA-L-Z-T-01 Dwg
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