58.42mm [2.300"]
1.27mm [0.050"]
32
31
26
25
7.00mm
[0.276"]
1.27mm
[0.050"]
2 1
Pin 1
23 24
TOP VIEW
45.72mm
[1.800"]
8 7
17 18
32.51mm
[1.280"]
9
10
15
16
1
6.50mm [0.256"]
43.94mm [1.730"]
5
SIDE VIEW
30.48mm
[1.200"] Assembled
4
2
3
21.26mm
[0.837"]
5.3mm [0.210"]
1
3.19mm
[0.126"]
0.8mm typ. [0.032"]
8.0mm [0.315"]
1
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
per IPC 4101/21, gold surface finish.
Substrate: 3.18mm ±0.18mm [0.125" ±0.007"]
FR4/G10 or equivalent high temp material.
Non-clad.
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Pins: shell material- Brass Alloy 360 1/2 hard;
finish- 0.25µm [10µ"] Au over 1.27µm [50µ"]
Ni (min.). Contact material- BeCu; finish
0.25µm [10µ"] Au over 2.54µm [100µ"] Ni
(min. ).
Test points: material- Phosphor Bronze; plating-
Sn over 1.27µm [50µ"] Ni. Gold flash on contact
end.
2
RoHS COMPLIANT
3
4
Description: Carrier Adaptor (CA)
32 position QFP ZIF socket (mini-grid on 0.040" centers)
to 32 position QFP surface-mountable leadless foot with test points.
5
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
CA-QFE32SA-L-Z-T-02F Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Drawing: H. Hansen
Scale: 1.5:1
Rev: A
Date: 1/8/06
Modified:
File: CA-QFE32SA-L-Z-T-02F Dwg
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