BZX55C-SERIES
ZENER DIODES
Zener Voltage:
2.4-180V
Peak Pulse Power:
500mW
FEATURE
DO-35(GLASS)
Low zener impedance
Low regulation factor
Glass passivated junction
High temperature soldering guaranteed:
260 C/10S/9.5mm lead length at 5 lbs tension
1.0 2(26.0)
MIN.
0.079(2.0)
MAX
0.165 (4.2)
0.138 (3.5)
MECHANICAL DATA
Case:
JEDEC DO-35(GLASS) molded glass body
Terminals:
Plated axial leads, solderable per MIL-STD 750,
method 2026
Polarity:
Color band denotes cathode end
Mounting Position:
Any
Weight:
0.005 ounce,0.14 grams
1.0 2(26.0)
MIN.
0.018(0.45)
TYP
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
MDD Catalog Number
SYMBOLS
VALUE
UNITS
Zener Current see Table Characteristics
Power Dissipation at Tamb=25 C(Note 1)
Junction Temperature
Storage Temperature Range
Thermal resistance junction ambient(Note 1
Forward voltage at I
F
=100mA
P
tot
T
j
T
STG
R
θJA
V
F
500
200
-65 to + 200
0.3
1.0
mW
C
C
K/mW
V
Note 1: Valid provided that leads at a distance of 10mm from case are kept at ambient temperature
RATINGS AND CHARACTERISTIC CURVES BZX55-SERIES
Breakdown characteristics
mA
50
Iz,TEST CURRENT,MILLIAMPERS
5
10
15
20
25
30
V
40
30
20
Test Current
Iz=5mA
10
0
2V4
6V8
6V2
5V6
5V1
4V7
4V3
3V9
3V3
P
tot,
POWER DISSIPATION,MILLIWATTS
9V1
500
400
300
200
100
0
0
12
11
50
15
100
150
20
200
22
24
27
Vz,ZENER VOLTAGE,volts
Admissible power dissipation versus ambient temperature
Valid provided that leads are kept at ambient temperature at a distance of 10mm from case
250
AMBIENT TEMPERATURE, C
The cruve graph is for reference only, can't be the basis for judgment(曲线图仅供参考)!
NXP MCU
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