Triple 2-channel analog multiplexer/demultiplexer
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC16,.1X.14,20 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| 模拟集成电路 - 其他类型 | SPDT |
| JESD-30 代码 | R-PQCC-N16 |
| JESD-609代码 | e4 |
| 长度 | 3.5 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 (Vsup) | -5 V |
| 信道数量 | 1 |
| 功能数量 | 3 |
| 端子数量 | 16 |
| 标称断态隔离度 | 50 dB |
| 通态电阻匹配规范 | 9 Ω |
| 最大通态电阻 (Ron) | 180 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC16,.1X.14,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | +-5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大信号电流 | 0.025 A |
| 最大供电电流 (Isup) | 0.16 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 4.5 V |
| 表面贴装 | YES |
| 最长断开时间 | 44 ns |
| 最长接通时间 | 48 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 2.5 mm |
| Base Number Matches | 1 |

| 74HCT4053BQ | 74HCT4053 | 74HCT4053DB | 74HCT4053N | 74HCT4053PW | 74HC4053 | 74HC4053DB | EP05Q04_2015 | 74HC4053PW | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Triple 2-channel analog multiplexer/demultiplexer | Triple 2-channel analog multiplexer/demultiplexer | Triple 2-channel analog multiplexer/demultiplexer | Triple 2-channel analog multiplexer/demultiplexer | Triple 2-channel analog multiplexer/demultiplexer | Triple 2-channel analog multiplexer/demultiplexer | Triple 2-channel analog multiplexer/demultiplexer | SBD | Triple 2-channel analog multiplexer/demultiplexer |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | - | 符合 | - | 符合 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | - | NXP(恩智浦) |
| 零件包装代码 | QFN | - | SSOP | - | TSSOP | - | SSOP | - | TSSOP |
| 包装说明 | HVQCCN, LCC16,.1X.14,20 | - | SSOP, SOP16,.25 | DIP, DIP16,.3 | TSSOP, TSSOP16,.25 | - | SSOP, SOP16,.25 | - | TSSOP, TSSOP16,.25 |
| 针数 | 16 | - | 16 | - | 16 | - | 16 | - | 16 |
| Reach Compliance Code | compliant | - | unknown | unknown | unknown | - | unknown | - | unknown |
| 模拟集成电路 - 其他类型 | SPDT | - | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SPDT | - | SINGLE-ENDED MULTIPLEXER | - | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PQCC-N16 | - | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | - | R-PDSO-G16 | - | R-PDSO-G16 |
| JESD-609代码 | e4 | - | e4 | e4 | - | - | e4 | - | e4 |
| 长度 | 3.5 mm | - | 6.2 mm | - | 5 mm | - | 6.2 mm | - | 5 mm |
| 湿度敏感等级 | 1 | - | 1 | - | 1 | - | 1 | - | 1 |
| 信道数量 | 1 | - | 1 | 1 | 1 | - | 1 | - | 1 |
| 功能数量 | 3 | - | 3 | 3 | 3 | - | 3 | - | 3 |
| 端子数量 | 16 | - | 16 | 16 | 16 | - | 16 | - | 16 |
| 标称断态隔离度 | 50 dB | - | 50 dB | 50 dB | 50 dB | - | 50 dB | - | 50 dB |
| 通态电阻匹配规范 | 9 Ω | - | 9 Ω | 9 Ω | 9 Ω | - | 8 Ω | - | 8 Ω |
| 最大通态电阻 (Ron) | 180 Ω | - | 180 Ω | 180 Ω | 180 Ω | - | 160 Ω | - | 160 Ω |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | - | 125 °C | - | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | - | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | - | SSOP | DIP | TSSOP | - | SSOP | - | TSSOP |
| 封装等效代码 | LCC16,.1X.14,20 | - | SOP16,.25 | DIP16,.3 | TSSOP16,.25 | - | SOP16,.25 | - | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度(摄氏度) | 260 | - | 260 | NOT SPECIFIED | 260 | - | 260 | - | 260 |
| 电源 | +-5 V | - | +-5 V | 5,GND/-5 V | +-5 V | - | 2/6,GND/-6 V | - | 2/6,GND/-6 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1 mm | - | 2 mm | - | 1.1 mm | - | 2 mm | - | 1.1 mm |
| 最大信号电流 | 0.025 A | - | 0.025 A | 0.025 A | 0.025 A | - | 0.025 A | - | 0.025 A |
| 最大供电电流 (Isup) | 0.16 mA | - | 0.16 mA | 0.16 mA | 0.16 mA | - | 0.16 mA | - | 0.16 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | - | 5.5 V | - | 10 V | - | 10 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | - | 4.5 V | - | 2 V | - | 2 V |
| 标称供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - | 5 V | - | 5 V |
| 表面贴装 | YES | - | YES | NO | YES | - | YES | - | YES |
| 最长断开时间 | 44 ns | - | 44 ns | 44 ns | 44 ns | - | 36 ns | - | 36 ns |
| 最长接通时间 | 48 ns | - | 48 ns | 48 ns | 48 ns | - | 37 ns | - | 37 ns |
| 切换 | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | - | CMOS | - | CMOS |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | - | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | - | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | - | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD | - | GULL WING | THROUGH-HOLE | GULL WING | - | GULL WING | - | GULL WING |
| 端子节距 | 0.5 mm | - | 0.65 mm | 2.54 mm | 0.65 mm | - | 0.65 mm | - | 0.65 mm |
| 端子位置 | QUAD | - | DUAL | DUAL | DUAL | - | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | NOT SPECIFIED | 30 | - | 30 | - | 30 |
| 宽度 | 2.5 mm | - | 5.3 mm | - | 4.4 mm | - | 5.3 mm | - | 4.4 mm |
| Base Number Matches | 1 | - | 1 | 1 | 1 | - | 1 | - | 1 |
| 是否无铅 | - | - | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | - | 不含铅 |
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