Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE42764D V50
MA001140440
PG-TO252-5-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
3.179
0.205
0.061
204.243
0.185
0.296
13.630
134.227
5.072
0.076
0.000
0.119
0.095
4.552
Average
Mass
[%]
0.87
0.06
0.02
55.81
0.05
0.08
3.72
36.68
1.39
0.02
0.00
0.03
0.03
1.24
28. August 2013
365.94 mg
Sum
[%]
0.87
Average
Mass
[ppm]
8687
559
168
55.89
0.05
558128
506
810
37247
40.48
1.39
366800
13861
208
0.02
1
326
260
1.30
12439
13025
1000000
208
404857
13861
558856
506
Sum
[ppm]
8687
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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