Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTS50080-1TEA
MA001081788
PG-TO252-5-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
plastics
noble metal
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
Polyimide
silver
tin
lead
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
26023-21-2
7440-22-4
7440-31-5
7439-92-1
Issued
Weight*
Weight
[mg]
5.583
0.205
0.061
204.243
2.015
1.366
23.896
111.289
5.072
0.076
0.000
0.143
0.086
0.069
3.272
Average
Mass
[%]
1.56
0.06
0.02
57.15
0.56
0.38
6.69
31.14
1.42
0.02
0.00
0.04
0.02
0.02
0.92
29. August 2013
357.38 mg
Sum
[%]
1.56
Average
Mass
[ppm]
15622
572
172
57.23
0.56
571507
5639
3821
66866
38.21
1.42
311406
14194
213
0.02
0.04
1
399
240
192
0.96
9156
9588
1000000
214
399
382093
14194
572251
5639
Sum
[ppm]
15622
wire
encapsulation
leadfinish
plating
glue
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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