IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP16, 0.300 INCH, PLASTIC, DIP-16, Multiplexer or Switch
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
模拟集成电路 - 其他类型 | SPST |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e0 |
长度 | 21.755 mm |
标称负供电电压 (Vsup) | -15 V |
正常位置 | NO |
信道数量 | 1 |
功能数量 | 4 |
端子数量 | 16 |
标称断态隔离度 | 50 dB |
通态电阻匹配规范 | 10 Ω |
最大通态电阻 (Ron) | 250 Ω |
最高工作温度 | 70 °C |
最低工作温度 | |
输出 | SEPARATE OUTPUT |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | +-15 V |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电流 (Isup) | 13.5 mA |
标称供电电压 (Vsup) | 15 V |
表面贴装 | NO |
切换 | BREAK-BEFORE-MAKE |
技术 | BIMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
LF13202N | LF13332N | LF13331N | LF13333M | LF13331M | LF13201N | LF13202M | LF13332M | |
---|---|---|---|---|---|---|---|---|
描述 | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP16, 0.300 INCH, PLASTIC, DIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP16, 0.300 INCH, PLASTIC, DIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP16, 0.300 INCH, PLASTIC, DIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, PLASTIC, SOP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, PLASTIC, SOP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDIP16, 0.300 INCH, PLASTIC, DIP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, PLASTIC, SOP-16, Multiplexer or Switch | IC QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO16, 0.150 INCH, PLASTIC, SOP-16, Multiplexer or Switch |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow | unknow | unknow |
模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
JESD-30 代码 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 21.755 mm | 21.755 mm | 21.755 mm | 9.9 mm | 9.9 mm | 21.755 mm | 9.9 mm | 9.9 mm |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
正常位置 | NO | NC | NO | NO/NC | NO | NC | NO | NC |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
标称断态隔离度 | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB | 50 dB |
通态电阻匹配规范 | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω | 10 Ω |
最大通态电阻 (Ron) | 250 Ω | 250 Ω | 250 Ω | 250 Ω | 250 Ω | 250 Ω | 250 Ω | 250 Ω |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
输出 | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | SOP | SOP | DIP | SOP | SOP |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | SOP16,.25 | SOP16,.25 | DIP16,.3 | SOP16,.25 | SOP16,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 1.75 mm | 1.75 mm | 5.08 mm | 1.75 mm | 1.75 mm |
最大供电电流 (Isup) | 13.5 mA | 13.5 mA | 13.5 mA | 13.5 mA | 13.5 mA | 13.5 mA | 13.5 mA | 13.5 mA |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | NO | NO | NO | YES | YES | NO | YES | YES |
切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | BIMOS | BIMOS | BIMOS | BIMOS | BIMOS | BIMOS | BIMOS | BIMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm |
厂商名称 | - | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) | National Semiconductor(TI ) |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved