SUGGESTED PAD LAYOUT
Based on IPC-7351A
X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC
C
X
Y
G
Z
Dimensions
Z
G
X
Y
C
X1-DFN1006-2 /
MiniMELF
X2-DFN1006-2
1.1
4.7
0.3
2.1
0.7
1.7
0.4
1.3
0.7
3.5
MELF
6.3
3.3
2.7
1.5
4.8
SOD123
4.9
2.5
0.7
1.2
3.7
SOD323
3.75
1.05
0.65
1.35
2.40
SOD523
2.3
1.1
0.8
0.6
1.7
SMA
6.5
1.5
1.7
2.5
4.0
SMB
6.8
1.8
2.3
2.5
4.3
SMC
9.4
4.4
3.3
2.5
6.8
X3-DFN0603-2
Z
C
X1-DFN1006-3 / X2-DFN1006-3
C
X
1
X
G2
Y (2x)
Dimensions Value (in mm)
C
0.355
X
0.230
Y
0.300
Z
0.610
G1
Y
X (2x)
Dimensions Value (in mm)
Z
1.1
G1
0.3
G2
0.2
X
0.7
X1
0.25
Y
0.4
C
0.7
Z
X1-DFN1212-3
X
Y
Y2
Y1
(2x)
C
X1
(2x)
Dimensions
C
X
X1
Y
Y1
Y2
Value (in mm)
0.80
0.42
0.32
0.50
0.50
1.50
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
1 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
X1-DFN1212-3
Type B
X
Y
X2
Y3
Y2
X1(2x)
Y1
(2x)
C
Dimensions
C
X
X1
X2
Y
Y1
Y2
Y3
Value (in mm)
0.80
0.42
0.32
0.90
0.50
0.50
0.20
1.50
X1-DFN1411-3
C
X2
X1
G2 X
Y
Z
G1
Dimensions
Z
G1
G2
X
X1
X2
Y
C
Value (in mm)
1.38
0.15
0.15
0.95
0.75
0.40
0.75
0.76
X1-DFN1612-6 / X2-DFN1310-6
G2
X2
Y2
G1
b
Y1
G3
a
X1
Dimensions X1-DFN1612-6 X2- DFN1310-6
G1
0.15
0.16
G2
0.175
0.17
G3
0.15
0.15
X1
0.60
0.52
X2
0.25
0.20
Y1
0.65
0.52
Y2
0.45
0.375
a
0.10
0.09
b
0.15
0.06
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
2 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN1616-6
Y
X2
G
X1
C
X2
a
G2
U-DFN1616-8
Dimensions Value (in mm)
Z
1.3
G
0.175
X1
0.50
X2
0.525
Y
0.30
C
0.50
Y2
Y1
G1
Dimensions Value (in mm)
G1
0.15
G2
0.20
X1
0.65
X2
0.25
Y1
1.25
Y2
0.50
C
0.40
a
0.10
Z
X1
C
U-DFN2018-6
X
Y
C
Y1
G
Dimensions
C
G
X
X1
Y
Y1
Value (in mm)
0.50
0.20
0.25
1.60
0.35
1.20
X1
U-DFN2020-3
X
X2
X4
Y3
Y4
R3
G
Y1
X1
C
Y2
Y5
X3
R2
Y
R1
Dimensions
C
G
X
X1
X2
X3
X4
Y
Value
Value
Dimensions
(in mm)
(in mm)
1.00
Y1
0.60
0.15
Y2
0.45
1.40
Y3
0.45
0.35
Y4
0.698
0.45
Y5
0.313
0.322
R1
0.225
0.60
R2
0.05
1.10
R3
0.20
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
3 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
U-DFN2020-3
Type B
X
Y1
U-DFN2020-6
Y
C
G
Dimensions
C
G
X
X1
Y
Y1
Y2
Y
G
X1
Y2
C
Value
(in mm)
1.30
0.24
0.35
1.52
1.09
0.47
0.50
X2
Dimensions
Z
G
X1
X2
Y
C
X1
G
Y
Z
Value
(in mm)
1.67
0.15
0.90
0.45
0.37
0.65
U-DFN2020-6
Type B
Y
X2
G1
X1
C
U-DFN2020-6
Type E
Value
(in mm)
1.67
0.20
0.40
1.0
0.45
0.37
0.70
0.65
Dimensions
G
Dimensions
C
X
X1
X2
Y
Y1
Y2
Y3
G
Y1
Z
Z
G
G1
X1
X2
Y
Y1
C
Y3 Y2
X2
Y1
X1
Value
(in mm)
0.650
0.400
0.285
1.050
0.500
0.920
1.600
2.300
X (6x)
C
Y (2x)
U-DFN2510-8
X1
X
X1
U-DFN2523-6
Dimensions
Y
Y1
G
c
c1
c
c1
G
X
X1
Y
Y1
Value
(in mm)
0.5
1.0
0.2
0.2
0.4
0.6
1.4
Y1
Y2
Y3
Y
C
X
Dimensions Value (in mm)
C
0.650
X
0.400
X1
1.700
Y
0.650
Y1
0.450
Y2
1.830
Y3
2.700
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
4 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
W-DFN3020-8
Type B
C
X
Y1
G
Y2
Y
G1
X1
Dimensions Value (in mm)
C
0.650
G
0.285
G1
0.090
X
0.400
X1
1.120
Y
0.730
Y1
0.500
Y2
0.365
U-DFN3030-4
Dimensions
C
G1
G2
G3
G4
G5
G6
G7
G8
R
X
X1
X2
X3
Y
Y1
Y2
Y3
Value (in mm)
1.300
0.100
0.150
0.830
0.115
0.135
0.170
0.500
0.500
0.150
0.500
1.375
1.225
1.175
1.980
1.015
0.715
0.650
U-DFN3030-8
C
Y3 (2x)
G4
X3
G6
G1
R
Y
G2
Z
Y2
G3
X1
Y1
G7
G5
X2
X1
G8
X2
Y
C
Dimensions Value (in mm)
Z
2.59
G
0.11
X1
2.49
X2
0.65
Y
0.39
C
0.65
G
X (4x)
U-DFN3030-8
Type E
X (x8)
Y
(x8)
C
Y1
Y2
Dimensions
C
C1
X
Y
Y1
Y2
Value (in mm)
0.65
2.35
0.30
0.65
1.60
2.75
C1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43
5 of 14
www.diodes.com
Suggested Pad Layout
© Diodes Incorporated
单片机
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
