Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE4961-3K
MA000935468
PG-SC59-3-5
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
silicon
titanium
chromium
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.350
0.001
0.005
0.016
5.236
0.028
0.077
1.648
5.940
0.255
0.158
0.023
0.108
Average
Mass
[%]
2.52
0.01
0.04
0.11
37.82
0.20
0.55
11.90
42.93
1.84
1.14
0.16
0.78
29. August 2013
13.84 mg
Sum
[%]
2.52
Average
Mass
[ppm]
25249
76
380
1139
37.98
0.20
378229
2000
5537
119042
55.38
1.84
1.14
429107
18439
11380
1649
0.94
7773
9422
1000000
553686
18439
11380
379824
2000
Sum
[ppm]
25249
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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