TMS320DM8147BCYE1在线购买

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TMS320DM8147BCYE1概述

DaVinci Digital Media Processor 684-FCBGA

TMS320DM8147BCYE1规格参数

参数名称	属性值
Brand Name	Texas Instruments
是否Rohs认证	符合
厂商名称	Texas Instruments(德州仪器)
零件包装代码	BGA
包装说明	FBGA, BGA688,28X28,32
针数	684
Reach Compliance Code	compli
ECCN代码	3A991.A.2
Factory Lead Time	1 week
地址总线宽度	28
位大小	32
边界扫描	YES
最大时钟频率	30 MHz
外部数据总线宽度	16
格式	FLOATING POINT
集成缓存	YES
JESD-30 代码	S-PBGA-B684
JESD-609代码	e1
长度	23 mm
低功率模式	YES
湿度敏感等级	4
端子数量	684
封装主体材料	PLASTIC/EPOXY
封装代码	FBGA
封装等效代码	BGA688,28X28,32
封装形状	SQUARE
封装形式	GRID ARRAY, FINE PITCH
峰值回流温度（摄氏度）	250
电源	0.95/1.35 V
认证状态	Not Qualified
RAM（字数）	16384
座面最大高度	3.06 mm
速度	1000 MHz
最大供电电压	1.42 V
最小供电电压	1.28 V
标称供电电压	1.35 V
表面贴装	YES
技术	CMOS
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	23 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC

TMS320DM8147BCYE1相似产品对比

	TMS320DM8147BCYE1	TMS320DM8147BCYE2	TMS320DM8148CCYE1	TMS320DM8148CCYE2	TMS320DM8147BCYE0	TMS320DM8148BCYE0	TMS320DM8148BCYE1	TMS320DM8148BCYE2	TMX320DM8148BCYE
描述	DaVinci Digital Media Processor 684-FCBGA	DaVinci Digital Media Processor 684-FCBGA 0 to 90	DaVinci Digital Media Processor 684-FCBGA	DaVinci Digital Media Processor 684-FCBGA	DaVinci Digital Media Processor 684-FCBGA	DaVinci Digital Media Processor 684-FCBGA 0 to 90	DaVinci Digital Media Processor 684-FCBGA 0 to 90	DaVinci Digital Media Processor 684-FCBGA 0 to 90	Digital Signal Processors & Controllers - DSP, DSC DaVinci Dig Media Proc
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合	符合
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	FBGA, BGA688,28X28,32	FBGA, BGA688,28X28,32	HBGA, BGA684,28X28,32	HBGA, BGA684,28X28,32	FBGA, BGA688,28X28,32	FBGA, BGA688,28X28,32	FBGA, BGA688,28X28,32	FBGA, BGA688,28X28,32	FBGA, BGA688,28X28,32
针数	684	684	684	684	684	684	684	684	684
Reach Compliance Code	compli	compli	compliant	compliant	compliant	compli	compli	compli	compli
ECCN代码	3A991.A.2	3A991.A.2	5A992.C	5A992.C	3A991.A.2	3A991.A.2	5A992.C	3A991.A.2	3A991.A.2
地址总线宽度	28	28	28	28	8	8	28	28	16
位大小	32	32	32	32	32	32	32	32	32
边界扫描	YES	YES	YES	YES	YES	YES	YES	YES	YES
最大时钟频率	30 MHz	30 MHz	30 MHz	30 MHz	30 MHz	30 MHz	30 MHz	30 MHz	30 MHz
外部数据总线宽度	16	16	16	16	16	16	16	16	16
格式	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
JESD-30 代码	S-PBGA-B684	S-PBGA-B684	S-PBGA-B684	S-PBGA-B684	S-PBGA-B684	S-PBGA-B684	S-PBGA-B684	S-PBGA-B684	S-PBGA-B684
长度	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm
低功率模式	YES	YES	YES	YES	YES	YES	YES	YES	YES
端子数量	684	684	684	684	684	684	684	684	684
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	FBGA	FBGA	HBGA	HBGA	FBGA	FBGA	FBGA	FBGA	FBGA
封装等效代码	BGA688,28X28,32	BGA688,28X28,32	BGA684,28X28,32	BGA684,28X28,32	BGA688,28X28,32	BGA688,28X28,32	BGA688,28X28,32	BGA688,28X28,32	BGA688,28X28,32
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, HEAT SINK/SLUG	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH	GRID ARRAY, FINE PITCH
峰值回流温度（摄氏度）	250	250	250	250	250	250	250	250	NOT SPECIFIED
电源	0.95/1.35 V	0.95/1.35 V	0.95/1.35 V	0.95/1.35 V	0.95/1.35 V	0.95/1.35 V	0.95/1.35 V	0.95/1.35 V	0.95/1.35 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字数）	16384	16384	16384	16384	16384	16384	16384	16384	16384
最大供电电压	1.42 V	1.42 V	1.42 V	1.42 V	1.16 V	1.16 V	1.42 V	1.42 V	1.26 V
最小供电电压	1.28 V	1.28 V	1.28 V	1.28 V	1.05 V	1.05 V	1.28 V	1.28 V	1.14 V
标称供电电压	1.35 V	1.35 V	1.35 V	1.35 V	1.1 V	1.1 V	1.35 V	1.35 V	1.2 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm	23 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	DIGITAL SIGNAL PROCESSOR, OTHER	DIGITAL SIGNAL PROCESSOR, OTHER	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
厂商名称	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	-	-	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)	Texas Instruments(德州仪器)
Factory Lead Time	1 week	1 week	1 week	1 week	1 week	-	-	1 week	-
集成缓存	YES	YES	YES	YES	-	-	YES	YES	YES
JESD-609代码	e1	e1	e1	e1	e1	e1	e1	e1	-
湿度敏感等级	4	4	4	4	4	4	4	4	-
座面最大高度	3.06 mm	3.06 mm	3.06 mm	3.06 mm	3.06 mm	-	3.06 mm	3.06 mm	3.37 mm
速度	1000 MHz	1000 MHz	1000 MHz	1000 MHz	-	-	1000 MHz	1000 MHz	1000 MHz
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	-
温度等级	-	-	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
最高工作温度	-	-	-	-	90 °C	90 °C	90 °C	90 °C	90 °C

TMS320DM8147BCYE1

TMS320DM8147BCYE1在线购买

TMS320DM8147BCYE1概述

TMS320DM8147BCYE1规格参数

TMS320DM8147BCYE1相似产品对比

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