P
OLYFUSE
®
R
ESETTABLE
F
USES
SMD0805
formerly No. 725
SMD Type, 6 V / 9 V / 15V
Standard
UL 1434 1 Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
st
Specifications
Packaging
A
Materials
Terminals:
Blistertape and reel Ø 178 mm
Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Solder Material: Sn
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider derating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3
Reflow only
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
Approvals
cULus Recognition
TÜV
Features
These devices offer wide range in hold currents
from 0.1 A to 1.0 A and voltages from 6 V to
15 V. The SMD0805 product line is suitable for
high density circuit board applications in com-
puters, cellular phone and general electronics.
Suitable for reflow soldering.
WebLinks
Further info see:
www.wickmanngroup.com
www.wickmanngroup.com/download/fuseology.pdf
Further application info see fuseology:
Dimensions (mm)
Solder pad Layout (mm)
1.2
1.5
1.0
Dimensions (mm)
Model
SMD0805P010TS/TF
SMD0805P020TS/TF
SMD0805P035TS/TF
SMD0805P050TS/TF
SMD0805P075TS/TF
SMD0805P100TS/TF
1.0
Min
2.00
2.00
2.00
2.00
2.00
2.00
A
Max
2.20
2.20
2.20
2.20
2.20
2.20
Min
1.20
1.20
1.20
1.20
1.20
1.20
B
Max
1.50
1.50
1.50
1.50
1.50
1.50
Min Max
0.55
0.55
0.45
0.75
0.75
0.80
1.00
1.00
0.75
1.25
1.25
1.80
C
D
Min
0.10
0.10
0.10
0.10
0.20
0.20
Min
0.20
0.20
0.20
0.20
0.15
0.15
E
Max
0.45
0.45
0.45
0.45
0.45
0.45
packaging quantity
tape
4,000
4,000
4,000
3,000
3,000
2,000
Permissible continuous operating current is
≤
100 % at ambient temperature of 20 ºC (68 ºF).
Model
cURus
•
•
•
•
p
p
TÜV
•
•
•
•
p
p
I
hold
(A)
0.10
0.20
0.35
0.50
0.75
1.00
I
Trip
(A)
0.30
0.50
0.75
1.00
1.50
1.95
V
max. dc
(V)
15
9
6
6
6
6
I
max.
(A)
40
40
40
40
40
40
max. time to trip
(sec. @ A)
1.50 @ 0.50
0.02 @ 8.00
0.10 @ 8.00
0.10 @ 8.00
0.20 @ 8.00
0.30 @ 8.00
P
d max.
(W)
0.5
0.5
0.5
0.5
0.6
0.6
Resistance
Approvals
R
min.
(
Ω
) R
typ.
(
Ω
) R
I max.
(
Ω
)
1.000
0.650
0.250
0.150
0.090
0.060
3.500
2.000
0.750
0.500
t.b.d.
t.b.d.
6.000
3.500
1.200
0.850
0.350
0.210
SMD0805P010TS/TF
SMD0805P020TS/TF
SMD0805P035TS/TF
SMD0805P050TS/TF
SMD0805P075TS/TF
SMD0805P100TS/TF
Please choose TS for SnPb and
TF
for Sn plating
NOTE:
I
hold
=
I
trip
=
V
max
=
I
max
=
Hold current: maximum current device will pass without tripping in 20 °C still air.
Trip current: minimum current at which the device will trip in 20 °C still air.
Maximum voltage device can withstand without damage at rated current (I
max
)
Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
=
Power dissipated from device when in the tripped state at 20 °C still air.
Minimum resistance of device in initial (un-soldered) state.
R
min
=
R
1max
= Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Caution: Operation beyond the specified rating may result in damage and possible arcing and
fl
ame.
Specifications are subject to change without notice
Order
Information
Qty.
Order-
Number
Model
Packaging
040617
WebSite
www.wickmanngroup.com
Europe
Tel: +49 2302 662-107
E-mail: sales@wickmann.com
Americas
Tel: +1 404 699-7820
E-mail: service@wickmannusa.com
Asia
Tel: +852 26 14-1108
China
Tel: +86 21 6432-5146
E-mail: sales@wickmann.com.hk E-mail: sales@wickmann.cn
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