Transient
SMCJ
Series
MERITEK
UL E223045
F
EATURES
For surface mounted applications in order to optimize board space.
Low profile package.
Built-in strain relief.
Glass passivated junction.
Low inductance.
Excellent clamping capability.
Repetition Rate (duty cycle): 0.05%.
Fast response time: typically less than 1.0ps from 0
volt
to
BV min.
Typical I
R
less than 1μA above 10V.
High Temperature soldering: 260°C/10 seconds at terminals.
Plastic package has Underwriters Laboratory Flammability 94V-O.
SMC/DO-214AB
M
ECHANICAL
D
ATA
M
DO-214AB. Molded plastic over glass passivated junction.
Case: JEDEC DO-201 Molded Plastic.
Terminal:
Axial
plated, solderable per MIL-STD-750, Method 2026.
Terminals:
Solder
leads, solderable per MIL-STD-750, Method 2026.
band denotes cathode
except Bipolar.
Polarity: Color and denotes
sc
t hode
except
Bidirectional.
Standard
Position: Any.
Mounting
Packaging: 12mm tape (EIA STD RS-481).
Weight: 0.007 ounce, 0.21 grams.
D
EVICES
F
OR
B
IPOLAR
A
PPLICATION
For
Bidirectional
use C or CA suffix for type SMCJ5.0 through type SMCJ440 (e.g. SMCJ5.0CA, SMCJ440CA);
Electrical
characteristics apply in both directions.
M
AXIMUM
R
ATINGS
C
HARACTERISTICS
Ratings at 25
ambient temperature unless otherwise specified.
RATING
P eak Pulse Power Dissipation on 10/1000 s waveform. (Note 1,
Note 2,
Fig. 1)
Peak Pulse Current on 10/1000 s waveform. (Note 1,Fig. 3)
Steady State Power Dissipation at T
L
=75
(Note
2,
Fig. 5)
Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed
on Rated Load.
(JEDEC
Method) (Note
3,
Fig. 6)
Operating junction and Storage Temperature Range
.
Lead length .375” (9.5mm).
SYMBOL
P
PPM
VALUE
Minimum
1,500
See
Table
6.5
200
-65 to
+150
UNIT
Watts
Amps
Watts
I
PPM
P
M(AV)
I
FSM
T
J
, T
STG
Amps
Notes: 1. Non-repetitive current pulse, per Fig. 3 and derated above T
A
= 25 per Fig. 2.
N
2. Mounted on
0.8mm
x
0.8mm
Copper Pads to each terminal
.
2
3. 8.3ms single half sine-wave, or equivalent square wave, Duty cycle = 4 pulses per minute maximum.
.
All specifications are subject to change without notice.
1
Rev 7
Transient
SMCJ
Series
MERITEK
R
ATING AND
C
HARACTERISTIC
C
URVES
Figure 1 - Peak Pulse Power Rating Curve
(T
A
: 25°C UNLESS OTHERWISE SPECIFIED)
Figure 2 - Pulse Derating Curve
100
P
PPM
-Peak Pulse Power (kW)
100
Peak Pulse Power (P
PP
) or
Current (I
PP
) Derating in
Percentage %
0.00001
0.0001
0.001
80
60
10
40
20
1
0.000001
0
0
25
50
75
100
125
150
175
t
d
-Pulse Width (sec.)
T
A
- Ambient temperature (ºC)
Figure 3 - Pulse Waveform
150
I
PPM
- Peak Pulse Current, % I
RSM
tr=10μsec
Peak Value
IPPM
TJ=25°C
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of IPPM
Figure 4 - Typical Junction Capacitance
100000
Bi-directional V=0V
10000
Uni-directional V=0V
100
Half Value
IPPM
IPPM
2
( )
10/1000μsec. Waveform
as defined by R.E.A
Cj (pF)
1000
Uni-directional @V
R
100
Bi-directional @V
R
50
10
Tj=25C
f=1.0MHz
Vsig=50mVp-p
0
td
0
1.0
2.0
t-Time (ms)
3.0
4.0
1
1.0
10.0
100.0
1000.0
V
BR
- Reverse Breakdown Voltage (V)
Figure 5 - Steady State Power Dissipation Derating Curve
6.5
6
5.5
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
25
50
75
100
125 150
T
A
- Ambient Temperature (ºC)
175
Figure 6 - Maximum Non-Repetitive Forward
Surge Current Uni-Directional Only
I
FSM
- Peak Forward Surge Current (A)
200
180
160
140
120
100
80
60
40
20
0
1
10
Number of Cycles at 60 Hz
100
P
M(AV)
, Steady Sate Power Dissipation
(W)
4
Rev 7
FPGA/CPLD
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