电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SIHFU9120

产品描述POWER, FET
产品类别分立半导体    晶体管   
文件大小1MB,共11页
制造商Vishay(威世)
官网地址http://www.vishay.com
下载文档 详细参数 选型对比 全文预览

SIHFU9120概述

POWER, FET

POWER, 场效应晶体管

SIHFU9120规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码TO-251
包装说明IN-LINE, R-PSIP-T3
针数3
Reach Compliance Codeunknow
ECCN代码EAR99
其他特性AVALANCHE RATED
雪崩能效等级(Eas)210 mJ
外壳连接DRAIN
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压100 V
最大漏极电流 (Abs) (ID)5.6 A
最大漏极电流 (ID)5.6 A
最大漏源导通电阻0.6 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码TO-251
JESD-30 代码R-PSIP-T3
JESD-609代码e0
元件数量1
端子数量3
工作模式ENHANCEMENT MODE
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)240
极性/信道类型P-CHANNEL
最大功率耗散 (Abs)42 W
最大脉冲漏极电流 (IDM)22 A
认证状态Not Qualified
表面贴装NO
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子位置SINGLE
处于峰值回流温度下的最长时间30
晶体管应用SWITCHING
晶体管元件材料SILICON
Base Number Matches1

文档预览

下载PDF文档
IRFR9120, IRFU9120, SiHFR9120, SiHFU9120
www.vishay.com
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
()
Q
g
(Max.) (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
- 100
V
GS
= - 10 V
18
3.0
9.0
Single
S
FEATURES
0.60
DPAK
(TO-252)
D
D
IPAK
(TO-251)
G
Dynamic dV/dt Rating
Repetitive Avalanche Rated
Surface Mount (IRFR9120, SiHFR9120)
Straight Lead (IRFU9120, SiHFU9120)
Available in Tape and Reel
P-Channel
Fast Switching
Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
DESCRIPTION
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effictiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
G
S
G
D S
D
P-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
Note
a. See device orientation.
DPAK (TO-252)
SiHFR9120-GE3
IRFR9120PbF
SiHFR9120-E3
DPAK (TO-252)
SiHFR9120TR-GE3
a
IRFR9120TRPbF
a
SiHFR9120T-E3
a
DPAK (TO-252)
SiHFR9120TRL-GE3
a
IRFR9120TRLPbF
a
SiHFR9120TL-E3
a
IPAK (TO-251)
SiHFU9120-GE3
IRFU9120PbF
SiHFU9120-E3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain
Current
a
Mount)
e
E
AS
I
AR
E
AR
T
C
= 25 °C
T
A
= 25 °C
P
D
dV/dt
T
J
, T
stg
for 10 s
V
GS
at - 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
LIMIT
- 100
± 20
- 5.6
- 3.6
- 22
0.33
0.020
210
- 5.6
4.2
42
2.5
- 5.5
- 55 to + 150
260
W/°C
mJ
A
mJ
W
V/ns
°C
A
UNIT
V
Linear Derating Factor
Linear Derating Factor (PCB
Single Pulse Avalanche Energy
b
Repetitive Avalanche Current
a
Repetitive Avalanche
Energy
a
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)
e
Peak Diode Recovery dV/dt
c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= - 25 V, starting T
J
= 25 °C, L = 10 mH, R
g
= 25
,
I
AS
= - 5.6 A (see fig. 12).
c. I
SD
- 6.8 A, dI/dt
110 A/μs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
S13-0167-Rev. C, 04-Feb-13
Document Number: 91280
1
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

SIHFU9120相似产品对比

SIHFU9120 SIHFR9120 SIHFR9120T SIHFR9120T-E3 SIHFR9120TL SIHFR9120TL-E3 SIHFU9120-E3
描述 POWER, FET POWER, FET POWER, FET POWER, FET POWER, FET POWER, FET POWER, FET
是否无铅 含铅 含铅 含铅 不含铅 含铅 不含铅 不含铅
是否Rohs认证 不符合 不符合 不符合 符合 不符合 符合 符合
零件包装代码 TO-251 TO-252 TO-252 TO-252 TO-252 TO-252 TO-251
包装说明 IN-LINE, R-PSIP-T3 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 IN-LINE, R-PSIP-T3
针数 3 3 3 3 3 3 3
Reach Compliance Code unknow unknow unknow unknow unknow unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
其他特性 AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED
雪崩能效等级(Eas) 210 mJ 210 mJ 210 mJ 210 mJ 210 mJ 210 mJ 210 mJ
外壳连接 DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 100 V 100 V 100 V 100 V 100 V 100 V 100 V
最大漏极电流 (Abs) (ID) 5.6 A 5.6 A 5.6 A 5.6 A 5.6 A 5.6 A 5.6 A
最大漏极电流 (ID) 5.6 A 5.6 A 5.6 A 5.6 A 5.6 A 5.6 A 5.6 A
最大漏源导通电阻 0.6 Ω 0.6 Ω 0.6 Ω 0.6 Ω 0.6 Ω 0.6 Ω 0.6 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码 TO-251 TO-252 TO-252 TO-252 TO-252 TO-252 TO-251
JESD-30 代码 R-PSIP-T3 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSIP-T3
JESD-609代码 e0 e0 e0 e3 e0 e3 e3
元件数量 1 1 1 1 1 1 1
端子数量 3 2 2 2 2 2 3
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE
峰值回流温度(摄氏度) 240 240 240 260 240 260 260
极性/信道类型 P-CHANNEL P-CHANNEL P-CHANNEL P-CHANNEL P-CHANNEL P-CHANNEL P-CHANNEL
最大功率耗散 (Abs) 42 W 42 W 42 W 42 W 42 W 42 W 42 W
最大脉冲漏极电流 (IDM) 22 A 22 A 22 A 22 A 22 A 22 A 22 A
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 NO YES YES YES YES YES NO
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn)
端子形式 THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
处于峰值回流温度下的最长时间 30 30 30 40 30 40 40
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON SILICON SILICON
Base Number Matches 1 - 1 1 1 1 1
湿度敏感等级 - - 1 1 1 1 1
vxWorks compress rom的解压缩速度问题,MIPS 24KEC CACHE 4路组相连
手上在做一个用MIPS32 24KEC的项目,CACHE这块似乎我一直没调对,后边都起的差不多了但是这里仍然有问题 体现如下:无论在config0最后3bit写0,2,3,7 就是写透关闭写回还有一个是UNCA ......
李四 实时操作系统RTOS
vivado生成IP核问题
vivado有个大工程,下面一堆子程序,当我生成ip核的时候,只生成了顶层的ip核,下面子程序的ip核都没有生成,这是为什么啊? ...
刘123 FPGA/CPLD
如何用\WINCE500\PUBLIC\SERVERS\SDK\SAMPLES下的ftpd文件夹做一个FTP服务器的exe呢(用EVC来实现)?
如何用\WINCE500\PUBLIC\SERVERS\SDK\SAMPLES下的ftpd文件夹里的那些文件做一个FTP服务器的exe呢(用EVC来实现)? 做出一个exe文件来,一点击就相当与建立了一个FTP服务器. 请高手给出思路,多谢! ......
stycx 嵌入式系统
如何当一个好的程序员?
rt...
liyananliy 嵌入式系统
初涉操作系统,该从何入手
非计算机专业的,在ARM平台上,需要跑操作系统(及写相关驱动),但是对操作系统没有深刻的理解(以前未涉及操作系统), 1、该从哪个操作系统下手对我来说比较现实? 2、是否需要研究操作系 ......
zsda2007 嵌入式系统
基于FPGA的USB接口IP核设计
2.1 UTM模块 USB总线数据线由DP和DN组成,是I/O端口。并行通过对DP和DN的上拉、下拉来区别低速USB设备和高速USB设备。 USB总线上的数据首先通过UTM,进行NRZI解码和位剥离后,串并转换为8位 ......
lhx654321 FPGA/CPLD

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2147  1818  2841  1351  2859  53  56  27  57  36 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved