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SIHFR224TL

产品描述VISHAY SILICONIX - IRFR224PBF - N CHANNEL MOSFET; 250V; 3.8A; D-PAK
产品类别分立半导体    晶体管   
文件大小347KB,共11页
制造商Vishay(威世)
官网地址http://www.vishay.com
下载文档 详细参数 选型对比 全文预览

SIHFR224TL概述

VISHAY SILICONIX - IRFR224PBF - N CHANNEL MOSFET; 250V; 3.8A; D-PAK

VISHAY SILICONIX - IRFR224PBF - N 通道 场效应管; 250V; 3.8A; D-PAK

SIHFR224TL规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Vishay(威世)
零件包装代码TO-252
包装说明SMALL OUTLINE, R-PSSO-G2
针数3
Reach Compliance Codeunknow
ECCN代码EAR99
其他特性AVALANCHE RATED
雪崩能效等级(Eas)130 mJ
外壳连接DRAIN
配置SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压250 V
最大漏极电流 (Abs) (ID)3.8 A
最大漏极电流 (ID)3.8 A
最大漏源导通电阻1.1 Ω
FET 技术METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码TO-252
JESD-30 代码R-PSSO-G2
JESD-609代码e0
元件数量1
端子数量2
工作模式ENHANCEMENT MODE
最高工作温度150 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)240
极性/信道类型N-CHANNEL
最大功率耗散 (Abs)42 W
最大脉冲漏极电流 (IDM)15 A
认证状态Not Qualified
表面贴装YES
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子位置SINGLE
处于峰值回流温度下的最长时间30
晶体管应用SWITCHING
晶体管元件材料SILICON

文档预览

下载PDF文档
IRFR224, IRFU224, SiHFR224, SiHFU224
www.vishay.com
Vishay Siliconix
Power MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
()
Q
g
(Max.) (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
14
2.7
7.8
Single
D
FEATURES
250
1.1
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Surface Mount (IRFR224, SiHFR224)
• Straight Lead (IRFU224, SiHFU224)
• Available in Tape and Reel
• Fast Switching
• Ease of Paralleling
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
DPAK
(TO-252)
D
D
IPAK
(TO-251)
G
G
S
G
D S
S
N-Channel MOSFET
DESCRIPTION
Third generation power MOSFETs form Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave solderig techniques. The straight
lead version (IRFU, SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
Lead (Pb)-free
Note
a. See device orientation.
DPAK (TO-252)
SiHFR224-GE3
IRFR224PbF
SiHFR224-E3
DPAK (TO-252)
SiHFR224TR-GE3
IRFR224TRPbF
a
SiHFR224T-E3
a
DPAK (TO-252)
SiHFR224TRL-GE3
IRFR224TRLPbF
a
SiHFR224TL-E3
a
IPAK (TO-251)
SiHFU224-GE3
IRFU224PbF
SiHFU224-E3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain
Current
a
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
LIMIT
250
± 20
3.8
2.4
15
0.33
0.020
E
AS
I
AR
E
AR
T
C
= 25 °C
T
A
= 25 °C
P
D
dV/dt
T
J
, T
stg
130
3.8
4.2
42
2.5
4.8
- 55 to + 150
260
W/°C
mJ
A
mJ
W
V/ns
°C
A
UNIT
V
Linear Derating Factor
Linear Derating Factor (PCB Mount)
e
Single Pulse Avalanche Energy
b
Repetitive Avalanche
Repetitive Avalanche
Current
a
Energy
a
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)
e
Peak Diode Recovery dV/dt
c
Operating Junction and Storage Temperature Range
for 10 s
Soldering Recommendations (Peak Temperature)
d
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
DD
= 50 V; starting T
J
= 25 °C, L = 14 mH, R
g
= 25
,
I
AS
= 3.8 A (see fig. 12).
c. I
SD
3.8 A, dI/dt
90 A/μs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
S13-0165-Rev. C, 04-Feb-13
Document Number: 91271
1
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000

SIHFR224TL相似产品对比

SIHFR224TL SIHFR224 SIHFR224-E3 SIHFR224T SIHFR224T-E3 SIHFR224TL-E3 SIHFU224 SIHFU224-E3
描述 VISHAY SILICONIX - IRFR224PBF - N CHANNEL MOSFET; 250V; 3.8A; D-PAK VISHAY SILICONIX - IRFR224PBF - N CHANNEL MOSFET; 250V; 3.8A; D-PAK VISHAY SILICONIX - IRFR224PBF - N CHANNEL MOSFET; 250V; 3.8A; D-PAK VISHAY SILICONIX - IRFR224PBF - N CHANNEL MOSFET; 250V; 3.8A; D-PAK VISHAY SILICONIX - IRFR224PBF - N CHANNEL MOSFET; 250V; 3.8A; D-PAK VISHAY SILICONIX - IRFR224PBF - N CHANNEL MOSFET; 250V; 3.8A; D-PAK VISHAY SILICONIX - IRFR224PBF - N CHANNEL MOSFET; 250V; 3.8A; D-PAK VISHAY SILICONIX - IRFR224PBF - N CHANNEL MOSFET; 250V; 3.8A; D-PAK
是否无铅 含铅 含铅 不含铅 含铅 不含铅 不含铅 含铅 不含铅
是否Rohs认证 不符合 不符合 符合 不符合 符合 符合 不符合 符合
厂商名称 Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世) Vishay(威世)
零件包装代码 TO-252 TO-252 TO-252 TO-252 TO-252 TO-252 TO-251 TO-251
包装说明 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 IN-LINE, R-PSIP-T3 IN-LINE, R-PSIP-T3
针数 3 3 3 3 3 3 3 3
Reach Compliance Code unknow unknow unknow unknow unknow unknow unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
其他特性 AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED AVALANCHE RATED
雪崩能效等级(Eas) 130 mJ 130 mJ 130 mJ 130 mJ 130 mJ 130 mJ 130 mJ 130 mJ
外壳连接 DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN DRAIN
配置 SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压 250 V 250 V 250 V 250 V 250 V 250 V 250 V 250 V
最大漏极电流 (Abs) (ID) 3.8 A 3.8 A 3.8 A 3.8 A 3.8 A 3.8 A 3.8 A 3.8 A
最大漏极电流 (ID) 3.8 A 3.8 A 3.8 A 3.8 A 3.8 A 3.8 A 3.8 A 3.8 A
最大漏源导通电阻 1.1 Ω 1.1 Ω 1.1 Ω 1.1 Ω 1.1 Ω 1.1 Ω 1.1 Ω 1.1 Ω
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码 TO-252 TO-252 TO-252 TO-252 TO-252 TO-252 TO-251 TO-251
JESD-30 代码 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSSO-G2 R-PSIP-T3 R-PSIP-T3
JESD-609代码 e0 e0 e3 e0 e3 e3 e0 e3
元件数量 1 1 1 1 1 1 1 1
端子数量 2 2 2 2 2 2 3 3
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C 150 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE
峰值回流温度(摄氏度) 240 240 260 240 260 260 240 260
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL N-CHANNEL
最大功率耗散 (Abs) 42 W 42 W 42 W 42 W 42 W 42 W 42 W 42 W
最大脉冲漏极电流 (IDM) 15 A 15 A 15 A 15 A 15 A 15 A 15 A 15 A
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES YES YES YES NO NO
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
处于峰值回流温度下的最长时间 30 30 40 30 40 40 30 40
晶体管应用 SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING
晶体管元件材料 SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON
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