• Load Switch, PA Switch, and for Portable Applications
D
3
4
Marking Code
AF
XXX
Lot Traceability
and Date Code
Part # Code
S
N-Channel
MOSFET
G
8
7
6
5
Bottom
View
Ordering Information:
Si5484DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS
T
A
= 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T
C
= 25 °C
T
C
= 70 °C
T
A
= 25 °C
T
A
= 70 °C
Symbol
V
DS
V
GS
I
D
I
DM
I
S
Limit
20
± 12
12
a
12
a
11.4
b, c
9.1
b, c
40
12
a
2.6
b, c
31
20
3.1
b, c
2
b, c
- 55 to 150
260
Unit
V
Continuous Drain Current (T
J
= 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
A
T
C
= 25 °C
T
A
= 25 °C
T
C
= 25 °C
T
C
= 70 °C
Maximum Power Dissipation
T
A
= 25 °C
T
A
= 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
d, e
P
D
T
J
, T
stg
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum
Maximum Junction-to-Case (Drain)
Junction-to-Ambient
b, f
t
≤
5s
Steady State
Symbol
R
thJA
R
thJC
Typical
34
3
Maximum
40
4
Unit
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (
http://www.vishay.com/doc?73257
). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 90 °C/W.
Document Number: 73589
S-81448-Rev. B, 23-Jun-08
www.vishay.com
1
Si5484DU
Vishay Siliconix
SPECIFICATIONS
T
J
= 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-on Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 9.1 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 9.1 A, V
GS
= 0 V
0.8
30
15
12
18
T
C
= 25 °C
12
40
1.2
60
30
A
V
ns
nC
ns
b
Symbol
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Test Conditions
V
GS
= 0 V, I
D
= 1 mA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 12 V
V
DS
= 20 V, V
GS
= 0 V
V
DS
= 20 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
5 V, V
GS
= 4.5 V
V
GS
=
4.5 V, I
D
= 7.6 A
V
GS
=
2.5 V, I
D
= 6.6 A
V
DS
= 10 V, I
D
= 7.6 A
Min.
20
Typ.
Max.
Unit
V
18.5
- 4.4
0.6
2
± 100
1
10
30
0.013
0.017
37
1600
0.016
0.021
µA
A
Ω
S
mV/°C
V
nA
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
V
DS
= 10 V, V
GS
= 10 V, I
D
= 11.4 A
320
210
35.5
16.5
3.5
55
25
pF
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 10 V, R
L
= 1.1
Ω
I
D
≅
9.3 A, V
GEN
= 10 V, R
g
= 1
Ω
V
DD
= 10 V, R
L
= 1.1
Ω
I
D
≅
9.1 A, V
GEN
= 4.5 V, R
g
= 1
Ω
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 11.4 A
f = 1 MHz
nC
4
4.5
10
30
30
10
5
15
35
10
15
45
45
15
10
25
55
15
ns
Ω
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 73589
S-81448-Rev. B, 23-Jun-08
Si5484DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
40
V
GS
= 5 thru 2.5
V
32
25 °C, unless otherwise noted
20
16
I
D
- Drain Current (A)
I
D
- Drain Current (A)
24
12
16
2
V
8
1.5
V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
8
T
C
= 125 °C
4
T
C
= 25 °C
T
C
= - 55 °C
0.5
1.0
1.5
2.0
2.5
0
0.0
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.040
2500
Transfer Characteristics
R
DS(on)
- On-Resistance (mΩ)
0.035
C - Capacitance (pF)
2000
C
iss
0.030
1500
0.025
V
GS
= 2.5
V
V
GS
= 4.5
V
1000
0.020
0.015
500
C
oss
0.010
0
8
16
24
32
40
0
0
C
rss
4
8
12
16
20
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage
10
I
D
= 11.4 A
V
GS
- Gate-to-Source
Voltage
(V)
8
R
DS(on)
- On-Resistance
(Normalized)
1.4
1.6
V
GS
= 10
V
I
D
= 7.6 A
Capacitance
1.2
6
V
DS
= 10
V
V
DS
= 16
V
1.0
4
0.8
2
0.6
0
0
8
16
24
32
40
0.4
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 73589
S-81448-Rev. B, 23-Jun-08
www.vishay.com
3
Si5484DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
40
R
DS(on)
- Drain-to-Source On-Resistance (mΩ)
0.05
I
D
= 7.6 A
0.04
I
S
- Source Current (A)
T = 150 °C
J
10
0.03
T
A
= 125 °C
T = 25 °C
J
0.02
T
A
= 25 °C
0.01
0
1
2
3
4
5
1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
- Source-to-Drain
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Source-Drain Diode Forward Voltage
1.4
1.3
1.2
1.1
V
GS(th)
(V)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
- 50
0
0.001
10
I
D
= 250
µA
Power (W)
30
40
50
On-Resistance vs. Gate-to-Source Voltage
20
- 25
0
25
50
75
100
125
150
0.01
0.1
1
Time (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
Single Pulse Power, Junction-to-Ambient
BVDSS Limited
100
µs
10
I
D
- Drain Current (A)
1 ms
10 ms
1
100 ms
0.1
1s
10 s
DC
T
A
= 25 °C
Single Pulse
0.01
0.1
1
10
100
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
Document Number: 73589
S-81448-Rev. B, 23-Jun-08
Si5484DU
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
40
35
30
32
Power Dissipation (W)
I
D
- Drain Current (A)
25
20
15
10
5
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
24
16
Package Limited
8
T
C
- Case Temperature (°C)
T
C
- Case Temperature (°C)
Current Derating*
Power Derating
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
stm32/stm8
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
