The properly and electrostatically measured taping materials are used for the components, but attention should be paid to the fact that there is some danger the parts absorb on the top
tapes to cause a failure in the mounting and the parts are destructed by static electricity (more than 1kV : 1J, 2A, 2B, 2E 0.5kV : 1E, Human Body Model 100pF 1.5kΩ) to change the
resistance in the conditions of an excessive dryness or after the parts are given vibration for a long time as they are packaged on the tapes. Similarly, care should be given not to apply the
excessive static electricity when mounting on the boards.
●
Ionic impurities such as flux etc. that are attached to these products or those mounted onto a PCB, negatively affect their moisture resistance, corrosion resistance, etc. The flux may
contain ionic substances like chlorine, acid, etc. while perspiration and saliva include ionic impurities like sodium (Na
＋
), chrorine (Cl
−
) etc. Therefore these kinds of ionic substances may
induce electrical corrosion when they invade into the products. Either thorough washing or using RMA solder and flux are necessary since lead free solder contains ionic substances.
Washing process is needed, before putting on moisture proof material in order to prevent electrical corrosion.
●
Please pay attention that the top of an iron does not direct touch to the components. There is a risk that may cause a change in resistance. Take care that another risk may happen that
the protecting coat is carbonized in an instant when touched directly by the top of the iron, also climatic-proof for electric corrosion or insulation of protecting coat may be dropped down.
Be sure not to give high temperature on the top of the iron as it will degrade the protecting coat.
●
Avoid storing components under direct sun rays, high temperature/humidity. Direct sun rays will cause quality change of taping and difficulty of keeping appropriate peeling strength. 5∼
35℃/35∼75%RH, there is no deterioration of solderability for 12 months, but take special care for storing, because condensation, dust, and toxic gas like hydrogen sulfide, sulfurous acid
gas, hydrogen chloride, etc. may drop solderability.
随着半导体技术的不断进步（按照摩尔定律），MCU内部集成的逻辑功能外设越来越多，存储器也越来越大。消费者对于汽车节能（经济和法规对排放的要求）型、舒适性、互联性、安全性（功能安全和信息安全）的要求越来越高，特别是近年来新能源电动车、车联网和自动驾驶技术的兴起，更大大加速了汽车电子技术的发展。汽车电子ECU（Electronic Control Unit--电控单元）集成的功能日益复杂，为了应对软...[详细]
近年来，中国厂家涌入面板行业，导致国际液晶显示屏价格一跌再跌。受此打击，行业巨头韩国LG Display公司遭创严重，昨日，他们公布了6年来的首次运营亏损。 由于行业技术革新，LG Display必须投入更多资金用于兴建OLED面板的生产线，也是他们利润下滑的一大原因。 LG Display CFO Don Kim表示：“市场变化的速度远超我们的预期。我们将采取有效、灵活的手段对资本指出...[详细]
汽车电子
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
