Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPP60R520E6
MA000837362
PG-TO220-3-1
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
phosphorus
iron
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
antimony
silver
tin
CAS#
if applicable
7440-21-3
7723-14-0
7439-89-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
3.425
0.422
1.407
1404.801
0.708
5.962
113.272
476.936
21.462
0.215
0.537
1.397
Average
Mass
[%]
0.17
0.02
0.07
69.18
0.03
0.29
5.58
23.49
1.06
0.01
0.03
0.07
29. August 2013
2030.54 mg
Sum
[%]
0.17
Average
Mass
[ppm]
1687
208
693
69.27
0.03
691834
349
2936
55784
29.36
1.06
234880
10570
106
265
0.11
688
1059
1000000
293600
10570
692735
349
Sum
[ppm]
1687
wire
encapsulation
leadfinish
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com