Preliminary
Datasheet
RJK1054DPB
100V, 20A, 22m max.
Silicon N Channel Power MOS FET
Power Switching
Features
High speed switching
Low drive current
Low on-resistance
R
DS(on)
= 17 m
typ. (at V
GS
= 10 V)
Pb-free
Halogen-free
High density mounting
R07DS0093EJ0300
Rev.3.00
Apr 11, 2013
Outline
RENESAS Package code: PTZZ0005DA-A
(Package name: LFPAK)
5
D
5
4
G
3
12
4
1, 2, 3
4
5
Source
Gate
Drain
S S S
1 2 3
Absolute Maximum Ratings
(Ta = 25°C)
Item
Drain to source voltage
Gate to source voltage
Drain current
Drain peak current
Body-drain diode reverse drain current
Avalanche current
Avalanche energy
Channel dissipation
Channel to Case Thermal Resistance
Channel temperature
Storage temperature
Notes: 1. PW
10
s,
duty cycle
1%
2. Value at L=10uH, Tch = 25C, Rg
50
3. Tc = 25C
Symbol
V
DSS
V
GSS
I
D
I
D(pulse)Note1
I
DR
I
AP Note 2
E
AS Note 2
Pch
Note3
ch-C
Tch
Tstg
Ratings
100
20
20
80
20
20
4.0
55
2.27
150
–55 to +150
Unit
V
V
A
A
A
A
mJ
W
C/W
C
C
R07DS0093EJ0300 Rev.3.00
Apr 11, 2013
Page 1 of 6
RJK1054DPB
Preliminary
Electrical Characteristics
(Ta = 25°C)
Item
Drain to source breakdown voltage
Gate to source leak current
Zero gate voltage drain current
Gate to source cutoff voltage
Static drain to source on state resistance
Forward transfer admittance
Input capacitance
Output capacitance
Reverse transfer capacitance
Gate Resistance
Total gate charge
Gate to source charge
Gate to drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Body–drain diode forward voltage
Body–drain diode reverse recovery time
Notes: 4. Pulse test
Symbol
V
(BR)DSS
I
GSS
I
DSS
V
GS(off)
R
DS(on)
|y
fs
|
Ciss
Coss
Crss
Rg
Qg
Qgs
Qgd
t
d(on)
t
r
t
d(off)
t
f
V
DF
t
rr
Min
100
—
—
2.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ
—
—
—
—
17
32
2000
350
80
0.5
27
9.0
4.5
12
3.8
32
5.4
0.8
48
Max
—
0.1
1
4.0
22
—
—
—
—
—
—
—
—
—
—
—
—
1.1
—
Unit
V
A
A
V
m
S
pF
pF
pF
nC
nC
nC
ns
ns
ns
ns
V
ns
Test Conditions
I
D
= 10 mA, V
GS
= 0 V
V
GS
=
20
V, V
DS
= 0 V
V
DS
= 100 V, V
GS
= 0 V
V
DS
= 10 V, I
D
= 1 mA
I
D
= 10 A, V
GS
= 10 V
Note4
I
D
= 10 A, V
DS
= 10 V
Note4
V
DS
= 10 V, V
GS
= 0 V,
f = 1 MHz
V
DD
= 50 V, V
GS
= 10 V,
I
D
= 20 A
V
GS
= 10 V, I
D
= 10 A,
V
DD
30 V, R
L
= 3
,
Rg = 4.7
I
F
= 20 A, V
GS
= 0 V
Note4
I
F
= 20 A, V
GS
= 0 V
di
F
/ dt = 100 A/
s
R07DS0093EJ0300 Rev.3.00
Apr 11, 2013
Page 2 of 6
RJK1054DPB
Preliminary
Main Characteristics
Power vs. Temperature Derating
80
1000
Maximum Safe Operation Area
Tc = 25°C
1 shot Pulse
Channel Dissipation Pch (W)
60
Drain Current I
D
(A)
100
10
40
1
m
s
20
1 Operation in
PW = 10 ms
this area is
limited by R
DS(on)
0.1
DC Operation
0.01
0.1
0
50
100
150
200
1
10
100
Case Temperature Tc (°C)
Drain to Source Voltage V
DS
(V)
Typical Output Characteristics
50
10 V 5.0 V
4.8 V Pulse Test
50
Typical Transfer Characteristics
V
DS
= 10 V
Pulse Test
Drain Current I
D
(A)
30
4.4 V
20
4.2 V
10
Drain Current I
D
(A)
40
4.6 V
40
30
20
Tc = 75°C
25°C
–25°C
10
V
GS
= 4.0 V
0
2
4
6
8
10
0
1
2
3
4
5
Drain to Source Voltage V
DS
(V)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
Gate to Source Voltage V
GS
(V)
Static Drain to Source on State Resistance
vs. Drain Current
100
Pulse Test
Drain to Source Saturation Voltage
V
DS (on)
(mV)
700
Pulse Test
560
V
GS
= 10 V
420
I
D
= 20 A
280
10 A
140
5A
1
0.1
10
0
4
8
12
16
20
1
10
100
Gate to Source Voltage V
GS
(V)
Drain Current I
D
(A)
R07DS0093EJ0300 Rev.3.00
Apr 11, 2013
Page 3 of 6
RJK1054DPB
Static Drain to Source on State Resistance
vs. Temperature
50
40
Pulse Test
I
D
= 10 A
10000
Preliminary
Typical Capacitance vs.
Drain to Source Voltage
Capacitance C (pF)
1000
Ciss
30
V
GS
= 10 V
20
100
V
GS
= 0 V
f = 1 MHz
Coss
Crss
40
60
80
100
10
0
–25
10
0
25
50
75
100 125 150
0
20
Case Temperature Tc (
°
C)
Drain to Source Voltage V
DS
(V)
Reverse Drain Current vs.
Source to Drain Voltage
Dynamic Input Characteristics
Drain to Source Voltage V
DS
(V)
Reverse Drain Current I
DR
(A)
I
D
= 20 A
V
DD
= 50 V
25 V
10 V
V
DS
V
GS
Gate to Source Voltage V
GS
(V)
100
20
20
Pulse Test
10 V
16
80
16
60
12
12
40
8
8
V
GS
= 0 V
20
V
DD
= 50 V
25 V
10 V
0
10
20
30
40
4
4
0
0
50
0
0.4
0.8
1.2
1.6
2.0
Gate Charge Qg (nC)
Source to Drain Voltage V
SD
(V)
Maximum Avalanche Energy vs.
Channel Temperature Derating
5
Avalanche Energy E
AS
(mJ)
4
3
2
1
0
25
50
75
100
125
150
Channel Temperature Tch (°C)
R07DS0093EJ0300 Rev.3.00
Apr 11, 2013
Page 4 of 6
RJK1054DPB
Normalized Transient Thermal Impedance vs. Pulse Width
Preliminary
Normalized Transient Thermal Impedance
γ
s (t)
3
Tc = 25°C
1
D=1
0.5
0.3
0.2
0.1
0.1
θch
– c (t) =
γ
s (t) •
θch
– c
θch
– c = 2.27°C/W, Tc = 25°C
P
DM
PW
T
1m
10 m
100 m
1
10
D=
PW
T
0.05
0.03
2
0.0
lse
1
t pu
0.0
ho
1s
0.01
10
μ
100
μ
Pulse Width PW (s)
Avalanche Test Circuit
Avalanche Waveform
1
2
L
•
I
AP2
•
V
DSS
V
DSS
– V
DD
V
(BR)DSS
I
AP
V
DD
V
DS
V
DS
Monitor
L
I
AP
Monitor
E
AS
=
Rg
D. U. T
I
D
Vin
15 V
50
Ω
0
V
DD
Switching Time Test Circuit
Vin Monitor
D.U.T.
Rg
R
L
V
DS
= 30 V
Vin
Vout
Vin
10 V
Vout
Monitor
Switching Time Waveform
90%
10%
10%
10%
90%
td(on)
tr
90%
td(off)
tf
R07DS0093EJ0300 Rev.3.00
Apr 11, 2013
Page 5 of 6
下载中心专版
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
