Thick Film Resistor Networks
R Series
(Single-in-Line, Low Profile )
Feature
Wide resistance range: 2291 to 1M (1 O - 3.3 M available)
Miniature package with maximum sealed heights 0.2"(5.08mm)
Highly stable thick film products
Products protected by tough epoxy conformal coating
Reduces total assembly cost
Mixed value resistances available
P
ART
N
UMBERING
S
YSTEM
R
Meritek Series
Circuit Configurations
A
09
103
G
Element No.
2 – 20
Resistance Value
The first two digits are significant figures
Of resistance value and the third denotes the number of zeros following
CODE
Value
331
330
472
4.7K
223
22K
104
100K
Resistance Tolerance
CODE
Tolerance
F
± 1%
G
± 2%
J
± 5%
Construction and Dimension
Rev. 7
Thick Film Resistor Networks
R Series
(Single-in-Line, Low Profile )
Item
Resistance to soldering heat
Solderability
Terminal Strength (Tensile Strength)
Exterior
Size
Requirement
∆R ≤
± (0.5% + 0.05Ω)
Over 95% of termination must be
covered with new solder.
∆R ≤
± (0.5% + 0.05Ω)
No mechanical damage.
No mechanical defect.
Within specification
Test Methods
With 350±5ºC , for 3 seconds
After immersing flus, dip in the 260ºC
Max. solder bath for 3±0.5 sec.
Tensile: 1Kg for 30 Sec.
Bending: 500g for 2 times
Visual
Calipers
Mechanical Characteristics
Electrical Characteristics
Item
Requirement
R<50Ω , ±250 PPM/ºC
50Ω≤R<2.2MΩ , ±100PPM/ºC
R≥2.2MΩ , ±250PPM/ºC
∆R ≤
± (0.5% + 0.05Ω)
Test Methods
X
TCR (PPM/°C)=
T1= 25ºC
T2= Test Temperature (-55°C ~ +125ºC)
R1: Resistance at Temp. T1
R2: Resistance at Temp. T2
2.5X Rated Voltage for 5 Sec. (200V max.)
Measure resistance after 30 minutes.
Temperature Coefficient (ppm / °C)
Short-Time Overload
Rev. 7
FPGA/CPLD
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