Low Power Microprocessor Supervisory with Battery Switch-Over
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | SIPEX |
包装说明 | PLASTIC, DIP-16 |
Reach Compliance Code | unknow |
其他特性 | MANUAL-RESET INPUT, WATCHDOG TIMER |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e0 |
长度 | 20.066 mm |
信道数量 | 2 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT APPLICABLE |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 5.334 mm |
最大供电电流 (Isup) | 0.075 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT APPLICABLE |
宽度 | 7.62 mm |
SP791CP | SP791EP | SP791EN | SP791CN | SP791 | |
---|---|---|---|---|---|
描述 | Low Power Microprocessor Supervisory with Battery Switch-Over | Low Power Microprocessor Supervisory with Battery Switch-Over | Low Power Microprocessor Supervisory with Battery Switch-Over | 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, PDSO16 | Low Power Microprocessor Supervisory with Battery Switch-Over |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - |
厂商名称 | SIPEX | SIPEX | SIPEX | SIPEX | - |
包装说明 | PLASTIC, DIP-16 | PLASTIC, DIP-16 | PLASTIC, SOIC-16 | PLASTIC, SOIC-16 | - |
Reach Compliance Code | unknow | unknow | unknow | unknow | - |
其他特性 | MANUAL-RESET INPUT, WATCHDOG TIMER | MANUAL-RESET INPUT, WATCHDOG TIMER | MANUAL-RESET INPUT, WATCHDOG TIMER | MANUAL-RESET INPUT, WATCHDOG TIMER | - |
可调阈值 | NO | NO | NO | NO | - |
模拟集成电路 - 其他类型 | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | POWER SUPPLY MANAGEMENT CIRCUIT | - |
JESD-30 代码 | R-PDIP-T16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | - |
JESD-609代码 | e0 | e0 | e0 | e0 | - |
长度 | 20.066 mm | 20.066 mm | 4.9 mm | 4.9 mm | - |
信道数量 | 2 | 2 | 2 | 2 | - |
功能数量 | 1 | 1 | 1 | 1 | - |
端子数量 | 16 | 16 | 16 | 16 | - |
最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | DIP | DIP | SOP | SOP | - |
封装等效代码 | DIP16,.3 | DIP16,.3 | SOP16,.25 | SOP16,.25 | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | - |
峰值回流温度(摄氏度) | NOT APPLICABLE | NOT APPLICABLE | 240 | 240 | - |
电源 | 5 V | 5 V | 5 V | 5 V | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
座面最大高度 | 5.334 mm | 5.334 mm | 1.75 mm | 1.75 mm | - |
最大供电电流 (Isup) | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA | - |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | - |
表面贴装 | NO | NO | YES | YES | - |
技术 | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | - |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | - |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | - |
处于峰值回流温度下的最长时间 | NOT APPLICABLE | NOT APPLICABLE | 30 | 30 | - |
宽度 | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | - |
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