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MX25L8006EM1I-12G/TUBE: 产品描述NOR Flash Serial 3.3V 8M-bit 8M/4M x 1/2-bit 8ns 8-Pin SOP; 文件大小1MB，共57页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx

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MX25L8006EM1I-12G/TUBE概述

NOR Flash Serial 3.3V 8M-bit 8M/4M x 1/2-bit 8ns 8-Pin SOP

MX25L8006EM1I-12G/TUBE规格参数

参数名称	属性值
欧盟限制某些有害物质的使用	Compliant
ECCN (US)	EAR99
Part Status	NRND
Cell Type	NOR
Chip Density (bit)	8M
Architecture	Sectored
Boot Block	No
Block Organization	Symmetrical
Address Bus Width (bit)	1
Sector Size	4Kbyte x 256
Page Size	256byte
Number of Bits/Word (bit)	1/2
Number of Words	8M/4M
Programmability	Yes
Timing Type	Synchronous
Max. Access Time (ns)	8
Maximum Erase Time (s)	15/Chip
Maximum Programming Time (ms)	5/Page
接口类型 Interface Type	Serial
Minimum Operating Supply Voltage (V)	2.7
Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	3.6
Programming Voltage (V)	2.7 to 3.6
Operating Current (mA)	12
Program Current (mA)	20
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Industrial
Command Compatible	Yes
ECC Support	No
Support of Page Mode	No
Supplier Package	SOP
Pin Count	8
Standard Package Name	SOP
Mounting	Surface Mount
Package Height	1.45
Package Length	4.9
Package Width	3.9
PCB changed	8
Lead Shape	Gull-wing

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MX25L8006E

3V, 8M-BIT [x 1/x 2]

CMOS SERIAL FLASH MEMORY

Key Features

• Hold Feature

• Low Power Consumption

• Auto Erase and Auto Program Algorithms

• Additional 512 bit secured OTP for unique identifier

P/N: PM1613

Rev. 1.6, August 28, 2017

MX25L8006E

Contents

FEATURES .................................................................................................................................................................. 5

GENERAL DESCRIPTION ......................................................................................................................................... 6

PIN CONFIGURATIONS ............................................................................................................................................. 7

PIN DESCRIPTION ...................................................................................................................................................... 7

BLOCK DIAGRAM....................................................................................................................................................... 8

MEMORY ORGANIZATION ......................................................................................................................................... 9

Table 1. Memory Organization ............................................................................................................................. 9

DEVICE OPERATION ................................................................................................................................................ 10

Figure 1. Serial Modes Supported...................................................................................................................... 10

DATA PROTECTION.................................................................................................................................................. 11

Table 2. Protected Area Sizes ............................................................................................................................ 12

Table 3. 512 bit Secured OTP Definition

............................................................................................................ 13

HOLD FEATURE........................................................................................................................................................ 14

Figure 2. Hold Condition Operation ................................................................................................................... 14

COMMAND DESCRIPTION ....................................................................................................................................... 15

Table 4. COMMAND DEFINITION ..................................................................................................................... 15

(1) Write Enable (WREN) ................................................................................................................................... 16

(2) Write Disable (WRDI) .................................................................................................................................... 16

(3) Read Status Register (RDSR) ...................................................................................................................... 16

Table 5. Status Register .................................................................................................................................... 17

(4) Write Status Register (WRSR) ...................................................................................................................... 17

Table 6. Protection Modes .................................................................................................................................. 18

(5) Read Data Bytes (READ) ............................................................................................................................. 19

(6) Read Data Bytes at Higher Speed (FAST_READ) ....................................................................................... 19

(7) Dual Output Mode (DREAD) ......................................................................................................................... 19

(8) Sector Erase (SE) ......................................................................................................................................... 19

(9) Block Erase (BE)........................................................................................................................................... 20

(10) Chip Erase (CE) .......................................................................................................................................... 20

(11) Page Program (PP) ..................................................................................................................................... 20

(12) Deep Power-down (DP) .............................................................................................................................. 21

(13) Release from Deep Power-down (RDP), Read Electronic Signature (RES) ............................................. 21

(14) Read Identification (RDID)

.......................................................................................................................... 22

(15) Read Electronic Manufacturer ID & Device ID (REMS) .............................................................................. 22

Table 7. ID DEFINITIONS ................................................................................................................................. 22

(16) Enter Secured OTP (ENSO) ....................................................................................................................... 22

(17) Exit Secured OTP (EXSO) .......................................................................................................................... 22

(18) Read Security Register (RDSCUR) ............................................................................................................ 23

Table 8. SECURITY REGISTER DEFINITION ................................................................................................... 23

(19) Write Security Register (WRSCUR) ............................................................................................................ 23

P/N: PM1613

Rev. 1.6, August 28, 2017

MX25L8006E

(20) Read SFDP Mode (RDSFDP)..................................................................................................................... 24

Figure 3. Read Serial Flash Discoverable Parameter (RDSFDP) Sequence..................................................... 24

Table 9. Signature and Parameter Identification Data Values

........................................................................... 25

Table 10. Parameter Table (0): JEDEC Flash Parameter Tables ....................................................................... 26

Table 11. Parameter Table (1): Macronix Flash Parameter Tables ..................................................................... 28

POWER-ON STATE ................................................................................................................................................... 30

ELECTRICAL SPECIFICATIONS .............................................................................................................................. 31

ABSOLUTE MAXIMUM RATINGS ..................................................................................................................... 31

Figure 4. Maximum Negative Overshoot Waveform ......................................................................................... 31

CAPACITANCE TA = 25°C, f = 1.0 MHz............................................................................................................. 31

Figure 5. Maximum Positive Overshoot Waveform ............................................................................................ 31

Figure 6. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL

............................................................. 32

Figure 7. OUTPUT LOADING ........................................................................................................................... 32

Figure 8. SCLK TIMING DEFINITION ................................................................................................................ 32

Table 12. DC CHARACTERISTICS.................................................................................................................... 33

Table 13. AC CHARACTERISTICS .................................................................................................................... 34

Timing Analysis ........................................................................................................................................................ 35

Figure 9. Serial Input Timing .............................................................................................................................. 35

Figure 10. Output Timing .................................................................................................................................... 35

Figure 11. Hold Timing ....................................................................................................................................... 36

Figure 12. WP# Disable Setup and Hold Timing during WRSR when SRWD=1 ............................................... 36

Figure 13. Write Enable (WREN) Sequence (Command 06) ............................................................................. 37

Figure 14. Write Disable (WRDI) Sequence (Command 04).............................................................................. 37

Figure 15. Read Status Register (RDSR) Sequence (Command 05) ................................................................ 38

Figure 16. Write Status Register (WRSR) Sequence (Command 01)............................................................... 38

Figure 17. Read Data Bytes (READ) Sequence (Command 03) ...................................................................... 38

Figure 18. Read at Higher Speed (FAST_READ) Sequence (Command 0B)................................................... 39

Figure 19. Dual Output Read Mode Sequence (Command 3B) ......................................................................... 40

Figure 20. Sector Erase (SE) Sequence (Command 20) .................................................................................. 40

Figure 21. Block Erase (BE) Sequence (Command 52 or D8) .......................................................................... 40

Figure 22. Chip Erase (CE) Sequence (Command 60 or C7) ........................................................................... 41

Figure 23. Page Program (PP) Sequence (Command 02)................................................................................ 41

Figure 24. Deep Power-down (DP) Sequence (Command B9) ........................................................................ 42

Figure 25. Release from Deep Power-down (RDP) Sequence (Command AB) .............................................. 42

Figure 26. Read Electronic Signature (RES) Sequence (Command AB) ......................................................... 42

Figure 27. Read Identification (RDID) Sequence (Command 9F)

...................................................................... 43

Figure 28. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90).............................. 43

Figure 29. Read Security Register (RDSCUR) Sequence (Command 2B) ........................................................ 44

Figure 30. Write Security Register (WRSCUR) Sequence (Command 2F) ....................................................... 44

Figure 31. Power-up Timing ............................................................................................................................... 45

Table 14. Power-Up Timing ............................................................................................................................... 45

P/N: PM1613

Rev. 1.6, August 28, 2017

MX25L8006EM1I-12G/TUBE相似产品对比

	MX25L8006EM1I-12G/TUBE	MX25L8006EM1I-12G	MX25L8006EM11-12G	MX25L8006EM1I-12G(TAPE/REEL)
描述	NOR Flash Serial 3.3V 8M-bit 8M/4M x 1/2-bit 8ns 8-Pin SOP	NOR Flash Serial 3.3V 8M-bit 8M/4M x 1/2-bit 8ns 8-Pin SOP	NOR Flash Serial 3.3V 8M-bit 8M/4M x 1/2-bit 8ns 8-Pin SOP	NOR Flash Serial 3.3V 8M-bit 8M/4M x 1/2-bit 8ns 8-Pin SOP
欧盟限制某些有害物质的使用	Compliant	Compliant	Compliant	Compliant
ECCN (US)	EAR99	EAR99	EAR99	EAR99
Part Status	NRND	NRND	NRND	NRND
Cell Type	NOR	NOR	NOR	NOR
Chip Density (bit)	8M	8M	8M	8M
Architecture	Sectored	Sectored	Sectored	Sectored
Boot Block	No	No	No	No
Block Organization	Symmetrical	Symmetrical	Symmetrical	Symmetrical
Address Bus Width (bit)	1	1	1	1
Sector Size	4Kbyte x 256	4Kbyte x 256	4Kbyte x 256	4Kbyte x 256
Page Size	256byte	256byte	256byte	256byte
Number of Bits/Word (bit)	1/2	1/2	1/2	1/2
Number of Words	8M/4M	8M/4M	8M/4M	8M/4M
Programmability	Yes	Yes	Yes	Yes
Timing Type	Synchronous	Synchronous	Synchronous	Synchronous
Max. Access Time (ns)	8	8	8	8
Maximum Programming Time (ms)	5/Page	5/Page	5/Page	5/Page
接口类型 Interface Type	Serial	Serial	Serial	Serial
Minimum Operating Supply Voltage (V)	2.7	2.7	2.7	2.7
Typical Operating Supply Voltage (V)	3.3	3.3	3.3	3.3
Maximum Operating Supply Voltage (V)	3.6	3.6	3.6	3.6
Programming Voltage (V)	2.7 to 3.6	2.7 to 3.6	2.7 to 3.6	2.7 to 3.6
Operating Current (mA)	12	12	12	12
Program Current (mA)	20	20	20	20
Minimum Operating Temperature (°C)	-40	-40	-40	-40
Maximum Operating Temperature (°C)	85	85	85	85
Supplier Temperature Grade	Industrial	Industrial	Industrial	Industrial
Command Compatible	Yes	Yes	Yes	Yes
ECC Support	No	No	No	No
Support of Page Mode	No	No	No	No
Supplier Package	SOP	SOP	SOP	SOP
Pin Count	8	8	8	8
Standard Package Name	SOP	SOP	SOP	SOP
Mounting	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Package Height	1.45	1.45	1.45	1.45
Package Length	4.9	4.9	4.9	4.9
Package Width	3.9	3.9	3.9	3.9
PCB changed	8	8	8	8
Lead Shape	Gull-wing	Gull-wing	Gull-wing	Gull-wing
Maximum Erase Time (S)	-	15/Chip	15/Chip	15/Chip

MX25L8006EM1I-12G/TUBE

MX25L8006EM1I-12G/TUBE概述

MX25L8006EM1I-12G/TUBE规格参数

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